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SN74ABTH16260DL

Texas Instruments

SN74ABTH16260DL by Texas Instruments

SN74ABTH16260DL by Texas Instruments is a 12-bit bus driver with 3-STATE output characteristics. It operates at a nominal voltage of 5V and has a max I (ol) of 64A, with a propagation delay of 5.3ns. This industrial-grade transceiver is ideal for applications requiring high-speed data transmission in harsh environments.

Median Price

$9.412

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,438 parts In-Stock

1+ parts

$9.627

100+ parts

$7.848

1k+ parts

$5.232

10k+ parts

-

1,438

$9.627

$7.848

$5.232

-

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$7.530

1k+ parts

$6.740

10k+ parts

$6.340

4,000

-

$7.530

$6.740

$6.340

DigiKey

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$9.910

1k+ parts

-

10k+ parts

-

4,000

-

$9.910

-

-

Verical

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

$9.412

1k+ parts

$8.425

10k+ parts

$7.925

1,600

-

$9.412

$8.425

$7.925

Arrow

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$7.244

1k+ parts

$7.029

10k+ parts

-

20

-

$7.244

$7.029

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,388 parts In-Stock

1+ parts

$6.906

100+ parts

-

1k+ parts

-

10k+ parts

-

1,388

$6.906

-

-

-

Vyrian

USA . 3,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,036

-

-

-

-

Inventory MP

USA . 189 parts In-Stock

1+ parts

-

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-

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189

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Bristol Electronics

USA . 189 parts In-Stock

1+ parts

-

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189

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-

-

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MRC Electronics

USA . 41 parts In-Stock

1+ parts

-

100+ parts

-

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41

-

-

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Sogenti Electronics

Canada . 39 parts In-Stock

1+ parts

-

100+ parts

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39

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Mil-Aero Solutions, Inc.

USA . 37 parts In-Stock

1+ parts

-

100+ parts

-

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37

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-

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

1+ parts

-

100+ parts

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10

-

-

-

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Resion

USA . 1 parts In-Stock

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-

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-

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1

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,256 parts In-Stock

1+ parts

$6.543

100+ parts

-

1k+ parts

-

10k+ parts

-

1,256

$6.543

-

-

-

Andel Nordic

Denmark . 4,584 parts In-Stock

1+ parts

$10.148

100+ parts

-

1k+ parts

$9.742

10k+ parts

$9.742

4,584

$10.148

-

$9.742

$9.742

Parana Technologies

USA . 2,158 parts In-Stock

1+ parts

$23.699

100+ parts

$2,200.804

1k+ parts

$21.329

10k+ parts

-

2,158

$23.699

$2,200.804

$21.329

-

DigiPath Technology Company

USA . 2,161 parts In-Stock

1+ parts

$26.095

100+ parts

-

1k+ parts

-

10k+ parts

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2,161

$26.095

-

-

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ChromeModa Solutions

Germany . 688 parts In-Stock

1+ parts

$26.628

100+ parts

$21.835

1k+ parts

-

10k+ parts

-

688

$26.628

$21.835

-

-

IDEA Electronic Components Group

UK . 619 parts In-Stock

1+ parts

$26.628

100+ parts

$25.297

1k+ parts

$23.965

10k+ parts

-

619

$26.628

$25.297

$23.965

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Perfect Parts

USA . 280 parts In-Stock

1+ parts

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280

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Kepictronics

USA . 161 parts In-Stock

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161

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Overview

Unleash the power of exceptional quality and reliability with the SN74ABTH16260DL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Bus Driver & Transceivers that excel in performance and versatility. Ideal for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers looking for seamless connectivity solutions. Upgrade your projects with confidence and trust in the innovative technology and superior craftsmanship of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and resistant to damage during transportation.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB and easy integration with other components.

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V ensures compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

Low load capacitance helps to minimize signal distortion and ensure reliable data transmission.

Maximum I (ol): 64 Amp

High maximum output current capability allows for driving larger loads without external amplification.

Propagation Delay (tpd): 5.3 ns

Low propagation delay ensures fast data transfer and minimal latency in communication.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable performance in harsh environmental conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and performance in extreme heat conditions.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the bus lines and enables efficient bus sharing among multiple devices.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74ABTH16260DL attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

12

No. of Functions:

1

No. of Ports:

3

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

63 mA

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74ABTH16260DL Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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