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SN74ABT543ADBRG4

Texas Instruments

SN74ABT543ADBRG4 by Texas Instruments

SN74ABT543ADBRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.2 ns and operates at a nominal voltage of 5V. It features a small outline package, dual terminal position, and independent control, making it ideal for bidirectional data transmission in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,888 parts In-Stock

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Digiode

USA . 1,283 parts In-Stock

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1,283

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Distributors (Availability)

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One Stop Electronics

USA . 869 parts In-Stock

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$3.000

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869

$3.000

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Component Stockers USA

USA . 8,382 parts In-Stock

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$7.060

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8,382

$7.060

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Andel Nordic

Denmark . 1,251 parts In-Stock

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$7.547

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$7.246

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$7.246

1,251

$7.547

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$7.246

AZTECH Wire

Italy . 484 parts In-Stock

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$13.637

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484

$13.637

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Parana Technologies

USA . 669 parts In-Stock

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$14.679

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$15.120

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669

$14.679

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$15.120

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DigiPath Technology Company

USA . 961 parts In-Stock

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$16.163

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961

$16.163

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ChromeModa Solutions

Germany . 6,450 parts In-Stock

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$16.493

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$13.524

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$16.493

$13.524

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IDEA Electronic Components Group

UK . 290 parts In-Stock

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$16.493

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$15.668

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$14.844

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290

$16.493

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$14.844

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Microchip USA

USA . 4,049 parts In-Stock

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Corphita

USA . 1,308 parts In-Stock

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Overview

Enhance your electronic designs with the SN74ABT543ADBRG4 by Texas Instruments, a high-quality bus driver and transceiver that offers reliable performance and versatility. Designed with cutting-edge BICMOS technology, this product boasts a wide range of applications and features such as independent control and true output polarity. With a small outline package and dual terminals, it provides ease of installation and maximum seated height of just 2mm. Trust in Texas Instruments' reputation for excellence and choose the SN74ABT543ADBRG4 to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, which is ideal for portable applications.

Propagation Delay At Nominal Supply: 6.2 ns

The low propagation delay ensures fast data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data and commands, making it versatile and suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with many existing systems and easy to integrate.

Output Characteristics: 3-STATE

The 3-state output allows for flexibility in signal control, enabling the bus driver to tri-state its outputs under certain conditions, improving system efficiency.

Technology: BICMOS

The BiCMOS technology used in this product combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption for optimal performance.

Technical Specifications

Bus Driver & Transceivers SN74ABT543ADBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74ABT543ADBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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