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SN74ABT541BDBRE4

Texas Instruments

SN74ABT541BDBRE4 by Texas Instruments

SN74ABT541BDBRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.9 ns at 5V, suitable for industrial applications. It features a 3-STATE output and operates within a temperature range of -40 to 85°C. The package style is small outline with shrink pitch, making it ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,984 parts In-Stock

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Digiode

USA . 4,345 parts In-Stock

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4,345

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 580 parts In-Stock

1+ parts

$3.065

100+ parts

-

1k+ parts

$2.942

10k+ parts

$2.942

580

$3.065

-

$2.942

$2.942

Component Stockers USA

USA . 5,280 parts In-Stock

1+ parts

$11.290

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5,280

$11.290

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AZTECH Wire

Italy . 373 parts In-Stock

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$12.119

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373

$12.119

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Parana Technologies

USA . 612 parts In-Stock

1+ parts

$28.371

100+ parts

$2,634.717

1k+ parts

$25.534

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612

$28.371

$2,634.717

$25.534

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DigiPath Technology Company

USA . 1,257 parts In-Stock

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$31.240

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1,257

$31.240

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ChromeModa Solutions

Germany . 1,552 parts In-Stock

1+ parts

$31.878

100+ parts

$26.140

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1,552

$31.878

$26.140

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IDEA Electronic Components Group

UK . 1,111 parts In-Stock

1+ parts

$31.878

100+ parts

$30.284

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$28.690

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1,111

$31.878

$30.284

$28.690

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One Stop Electronics

USA . 218 parts In-Stock

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$44.000

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Corphita

USA . 3,972 parts In-Stock

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Microchip USA

USA . 2,104 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the Texas Instruments SN74ABT541BDBRE4 Bus Driver & Transceivers. Crafted with precision and reliability in mind, this product offers top-tier performance for a multitude of applications. From enhancing communication systems to optimizing control interfaces, this versatile component delivers unparalleled value and efficiency. Trust in Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the SN74ABT541BDBRE4 and experience the next level of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring the product can withstand regular use and transportation.

Propagation Delay At Nominal Supply: 3.9 ns

Low propagation delay ensures quick signal transmission, making this product suitable for applications where rapid response is required.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 8

8-bit capacity provides sufficient data transmission capabilities for a wide range of applications, making this product versatile and adaptable.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with common power sources, making integration into existing systems seamless.

Load Capacitance (CL): 50 pF

With a manageable load capacitance, this product can efficiently drive connected devices without experiencing performance issues related to excessive capacitance.

Power Supplies (V): 5

The availability of 5V power supplies ensures consistent and reliable operation, making this product a dependable choice for various applications.

No. of Terminals: 20

Having 20 terminals allows for multiple connection points, enabling flexible and customized configurations to meet specific system requirements.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the circuit board, making this product ideal for compact designs and applications with limited room for components.

Maximum I (ol): 64 Amp

High output current capability of 64A ensures the product can drive power-hungry devices and components without the risk of overload or overheating.

Propagation Delay (tpd): 3.9 ns

Low propagation delay of 3.9ns facilitates fast and efficient signal transmission, optimizing system performance and responsiveness.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand harsh environmental conditions and high-temperature environments, expanding its range of potential applications.

Output Characteristics: 3-STATE

3-state output characteristics allow the product to drive multiple loads and switch between high, low, and high-impedance states, offering flexible control options for various scenarios.

Minimum Operating Temperature: -40 °C

Operating reliably at temperatures as low as -40°C makes this product suitable for use in cold or freezing environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring lasting performance and reliability.

Terminal Position: DUAL

Dual terminal position allows for versatile and reversible connection options, accommodating different circuit board layouts and configurations.

No. of Ports: 2

Having two ports provides additional connectivity options and flexibility for connecting to multiple devices or systems simultaneously.

Maximum Seated Height: 2 mm

Low maximum seated height of 2mm saves vertical space on the circuit board, enabling compact and streamlined designs.

Width: 5.3 mm

Narrow width of 5.3mm allows for efficient space utilization on the circuit board, especially in applications where size constraints are a concern.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with devices that require specific polarity for proper operation.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage requirement of 4.5V, this product can operate effectively across a range of power sources, providing versatility and reliability.

Peak Reflow Temperature °C: 260

Ability to withstand a peak reflow temperature of 260°C ensures the product can undergo solder reflow processes during assembly without damage.

Length: 7.2 mm

Compact length of 7.2mm contributes to overall space-saving design considerations, making this product suitable for applications with limited board space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding industrial environments with varying temperature conditions.

Technology: BICMOS

Employing BICMOS technology combines the benefits of bipolar and CMOS technologies, offering high-speed operation, low power consumption, and robust performance characteristics.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, enhancing durability and ensuring stable electrical contact.

Packing Method: TR

TR packing method (tape and reel) facilitates easy handling, storage, and automated pick-and-place assembly in manufacturing processes, improving efficiency and productivity.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this product offers precise and compact terminal spacing, enabling high-density mounting on the circuit board.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies system design and operation by providing consistent and predictable data transmission flow in a single direction.

Control Type: ENABLE LOW

Enable low control type ensures reliable and efficient signal activation by utilizing a logic level that is easily interpreted and implemented in various applications.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage of 5.5V offers a safe operating range for the product, protecting it from potential voltage spikes or overloads that could damage sensitive components.

Maximum Power Supply Current (ICC): 30 mA

With a maximum power supply current of 30mA, this product operates efficiently and consumes low power, contributing to energy savings and extended device lifespan.

Technical Specifications

Bus Driver & Transceivers SN74ABT541BDBRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74ABT541BDBRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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