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SN65HVD1050MDREPG4

Texas Instruments

SN65HVD1050MDREPG4 by Texas Instruments

SN65HVD1050MDREPG4 by Texas Instruments is a network interface IC with 1 transceiver. It operates at a data rate of 1 Mbps and has a nominal voltage of 5V. It is commonly used in military applications due to its temperature grade and small outline package style.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 17,706 parts In-Stock

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Vyrian

USA . 3,162 parts In-Stock

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Digiode

USA . 2,788 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Parana Technologies

USA . 405 parts In-Stock

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$6.119

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$6.891

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405

$6.119

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DigiPath Technology Company

USA . 503 parts In-Stock

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$6.738

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$6.198

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IDEA Electronic Components Group

UK . 2,019 parts In-Stock

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$6.875

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$6.188

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$6.875

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ChromeModa Solutions

Germany . 1,135 parts In-Stock

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$6.875

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$5.638

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$6.875

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AZTECH Wire

Italy . 665 parts In-Stock

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$9.105

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Corohmni

South Africa . 329 parts In-Stock

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$11.261

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$18.313

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$17.398

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Component Stockers USA

USA . 737 parts In-Stock

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$99.990

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Ampacity Inc.

Singapore . 1,306 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,093 parts In-Stock

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$541.000

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$527.475

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Continental Prestige Electronics

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Microchip USA

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Corphita

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Argo Parts USA

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Bastille Electronics

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Overview

Experience unmatched quality and reliability with the SN65HVD1050MDREPG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a network interface solution that delivers exceptional performance for a wide range of applications. With its compact design and superior packaging material, this product offers convenience and durability. Whether you're in telecommunications or require interface circuits, the SN65HVD1050MDREPG4 is your go-to choice. Enjoy the benefits of seamless connectivity, high data rates of up to 1 Mbps, and low power consumption. Trust Texas Instruments to provide you with the value and advantages you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body enhances durability and makes the product resistant to external impacts, making it a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy installation and efficient space utilization, making it convenient for integration into various devices.

No. of Functions: 1

With a single function, this product offers simplicity and focused functionality, making it ideal for specific network interface applications.

Package Shape: RECTANGULAR

The rectangular package shape provides easy compatibility with standard electronic components and ensures efficient utilization of board space.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with common power supply systems, allowing for seamless integration into various setups.

No. of Terminals: 8

With 8 terminals, this product provides sufficient connectivity options for seamless data transmission and interface with other devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable space on the circuit board, enabling compact designs without compromising on performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature capability allows this product to withstand harsh environmental conditions, ensuring reliability even in extreme scenarios.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes this product suitable for deployment in environments with extremely low temperatures, extending its versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent contact reliability, corrosion resistance, and superior electrical performance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for flexibility in the product's orientation during installation, providing convenience and flexibility for different system configurations.

Maximum Seated Height: 1.75 mm

With a low maximum seated height, this product can be easily integrated into compact devices, allowing for efficient space utilization.

Width: 3.9 mm

The narrow width of this product enables its easy integration into space-constrained setups without compromising on performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures robust soldering and reliable connection during assembly processes, guaranteeing product performance and longevity.

Length: 4.9 mm

The compact length of this product makes it suitable for installation in small electronic devices, providing versatility and space-saving advantages.

Temperature Grade: MILITARY

The military-grade temperature rating indicates that this product is designed to withstand rugged and demanding conditions, making it a reliable choice in challenging environments.

Terminal Form: GULL WING

The gull-wing terminal form offers secure and stable soldering connections, enhancing the product's overall reliability and electrical performance.

No. of Transceivers: 1

With a single transceiver, this product provides a cost-effective and straightforward solution for network interface applications requiring data transmission and reception capabilities.

Maximum Supply Current: 0.07 mA

The low maximum supply current requirement ensures energy efficiency and reduces power consumption, making this product suitable for applications with limited power availability.

Telecom IC Type: INTERFACE CIRCUIT

As an interface circuit telecom IC type, this product facilitates seamless communication between different devices and networks, enhancing interoperability and connectivity.

Nominal Supply Voltage: 5 V

The use of a 5V nominal supply voltage ensures compatibility with standard power sources, making this product widely applicable and easy to integrate into various systems.

Terminal Pitch: 1.27 mm

With a precise terminal pitch of 1.27mm, this product offers reliable electrical connections and enables compatibility with industry-standard connectors and interfaces.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this product provides a suitable solution for applications requiring moderate-speed data transmission, offering a balance between performance and efficiency.

Moisture Sensitivity Level (MSL): 1

With an MSL level of 1, this product exhibits superior moisture resistance, ensuring its reliable operation even in humid environments, making it a durable choice.

Technical Specifications

Network Interfaces SN65HVD1050MDREPG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.07 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD1050MDREPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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