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SN64BCT757DWRE4

Texas Instruments

SN64BCT757DWRE4 by Texas Instruments

SN64BCT757DWRE4 by Texas Instruments is a Bus Driver & Transceiver with 11.2ns Propagation Delay, 4-bit data width, and 5V supply voltage. It is used in industrial applications for unidirectional signal transmission with open-collector output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,740 parts In-Stock

1+ parts

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4,740

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North Shore Components

USA . 1,855 parts In-Stock

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1,855

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Digiode

USA . 51 parts In-Stock

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51

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Distributors (Availability)

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Andel Nordic

Denmark . 492 parts In-Stock

1+ parts

$1.140

100+ parts

-

1k+ parts

$1.095

10k+ parts

$1.095

492

$1.140

-

$1.095

$1.095

AZTECH Wire

Italy . 350 parts In-Stock

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$4.898

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350

$4.898

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Parana Technologies

USA . 1,918 parts In-Stock

1+ parts

$29.374

100+ parts

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$58.670

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1,918

$29.374

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$58.670

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DigiPath Technology Company

USA . 265 parts In-Stock

1+ parts

$32.345

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265

$32.345

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ChromeModa Solutions

Germany . 5,132 parts In-Stock

1+ parts

$33.005

100+ parts

$27.064

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5,132

$33.005

$27.064

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IDEA Electronic Components Group

UK . 1,275 parts In-Stock

1+ parts

$33.005

100+ parts

$31.355

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$29.704

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1,275

$33.005

$31.355

$29.704

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One Stop Electronics

USA . 995 parts In-Stock

1+ parts

$65.000

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995

$65.000

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Microchip USA

USA . 11,710 parts In-Stock

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11,710

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Corphita

USA . 1,773 parts In-Stock

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Overview

Elevate your circuits with the SN64BCT757DWRE4 by Texas Instruments, a top-of-the-line bus driver and transceiver that brings unparalleled quality and reliability to your projects. With its advanced technology and industrial-grade design, this product offers superior performance and efficiency. Whether you're working on automotive, industrial, or consumer electronics applications, this small outline package delivers outstanding results. Trust Texas Instruments to provide innovative solutions that elevate your work to the next level. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the product lightweight and durable, ideal for portable applications.

Propagation Delay At Nominal Supply: 11.2 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly, saving time and cost in production.

No. of Functions: 2

Having multiple functions in a single device increases functionality and reduces component count in the circuit design.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of board space and easy integration into the overall system design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage simplifies power management and compatibility with other components in the system.

Load Capacitance (CL): 50 pF

Optimized load capacitance ensures signal integrity and reliable performance in various operating conditions.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for flexible interfacing with external components, offering versatility in system design.

Technical Specifications

Bus Driver & Transceivers SN64BCT757DWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TRISTATE CONTROL INPUT ACTIVE HIGH FOR ONE FUNCTION

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

77 mA

Propagation Delay At Nominal Supply:

11.2 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN64BCT757DWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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