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SN64BCT126ADRE4

Texas Instruments

SN64BCT126ADRE4 by Texas Instruments

SN64BCT126ADRE4 by Texas Instruments is a 14-terminal bus driver with 7.7ns propagation delay at 5V, suitable for industrial applications. It features 3-STATE output characteristics, BICMOS technology, and operates b/w -40 to 85°C. Ideal for driving buses in electronic systems requiring fast signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,731 parts In-Stock

1+ parts

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5,731

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Digiode

USA . 2,367 parts In-Stock

1+ parts

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2,367

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,704 parts In-Stock

1+ parts

$4.526

100+ parts

-

1k+ parts

$4.344

10k+ parts

$4.344

1,704

$4.526

-

$4.344

$4.344

Parana Technologies

USA . 595 parts In-Stock

1+ parts

$14.188

100+ parts

-

1k+ parts

$14.644

10k+ parts

-

595

$14.188

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$14.644

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DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

$15.623

100+ parts

$14.373

1k+ parts

-

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2,004

$15.623

$14.373

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ChromeModa Solutions

Germany . 5,224 parts In-Stock

1+ parts

$15.942

100+ parts

$13.072

1k+ parts

-

10k+ parts

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5,224

$15.942

$13.072

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IDEA Electronic Components Group

UK . 1,682 parts In-Stock

1+ parts

$15.942

100+ parts

$15.145

1k+ parts

$14.348

10k+ parts

-

1,682

$15.942

$15.145

$14.348

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$18.653

100+ parts

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789

$18.653

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One Stop Electronics

USA . 1,261 parts In-Stock

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$22.000

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1,261

$22.000

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Corphita

USA . 4,942 parts In-Stock

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4,942

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Overview

Elevate your electronic designs with the SN64BCT126ADRE4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. As part of the Bus Driver & Transceivers category, this versatile component offers unparalleled value with its 3-STATE output characteristics and true output polarity. Perfect for a wide range of applications, this small outline package boasts a propagation delay of 7.7 ns and a maximum operating temperature of 85°C, ensuring reliable performance in industrial settings. Trust Texas Instruments to deliver innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 7.7 ns

Low propagation delay ensures fast signal transmission, making the bus driver efficient in data communication.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage simplifies power requirements and compatibility with other components.

Package Style (Meter): SMALL OUTLINE

Compact small outline package saves space on the PCB, making it suitable for use in tight layouts or designs.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, reducing power consumption and enabling bus sharing in multi-device systems.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the bus driver can withstand harsh environmental conditions and industrial applications.

Technology: BICMOS

Using BiCMOS technology offers the advantages of both bipolar and CMOS technologies, providing high speed and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN64BCT126ADRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION

Control Type:

ENABLE HIGH

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

51 mA

Propagation Delay At Nominal Supply:

7.7 ns

Propagation Delay (tpd):

7.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN64BCT126ADRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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