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SN64BCT126ADG4

Texas Instruments

SN64BCT126ADG4 by Texas Instruments

SN64BCT126ADG4 by Texas Instruments is a 14-terminal bus driver with 7.7 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and has a max power supply current of 51mA. The device features true output polarity and supports surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,638 parts In-Stock

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Digiode

USA . 83 parts In-Stock

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83

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 554 parts In-Stock

1+ parts

$10.000

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554

$10.000

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AZTECH Wire

Italy . 488 parts In-Stock

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$16.239

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488

$16.239

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Parana Technologies

USA . 306 parts In-Stock

1+ parts

$24.824

100+ parts

$2,305.274

1k+ parts

$22.341

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306

$24.824

$2,305.274

$22.341

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DigiPath Technology Company

USA . 1,583 parts In-Stock

1+ parts

$27.334

100+ parts

$25.147

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1,583

$27.334

$25.147

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ChromeModa Solutions

Germany . 6,315 parts In-Stock

1+ parts

$27.892

100+ parts

$22.871

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6,315

$27.892

$22.871

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IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$27.892

100+ parts

$26.497

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$25.103

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93

$27.892

$26.497

$25.103

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Corphita

USA . 91 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN64BCT126ADG4 Bus Driver & Transceivers. This versatile component offers unmatched performance in a wide range of applications, providing customers with exceptional value and benefits. With a fast propagation delay, 3-state output characteristics, and industrial-grade temperature tolerance, this product is a must-have for any electronics project. Trust Texas Instruments for cutting-edge technology and innovation that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 7.7 ns

Low propagation delay ensures fast and efficient signal transmission in the bus driver & transceiver.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the bus driver & transceiver on a circuit board.

No. of Functions: 4

Multiple functions in a single device provide versatility and efficiency in managing bus operations.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board, optimizing overall design.

Nominal Supply Voltage / Vsup (V): 5

Standard nominal supply voltage of 5V ensures compatibility with most systems and power sources.

Load Capacitance (CL): 50 pF

Optimal load capacitance of 50 pF ensures stable and reliable performance of the bus driver & transceiver.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures reliable operation of the bus driver & transceiver.

No. of Terminals: 14

Sufficient number of terminals provide connectivity options for various external components and interfaces.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact integration of the bus driver & transceiver.

Maximum I (ol): 64 Amp

High maximum output current of 64 Amps allows for driving multiple loads with ease.

Propagation Delay (tpd): 7.7 ns

Low propagation delay ensures minimal signal delay and fast response time in bus communication.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of up to 85°C ensures reliable performance in various environmental conditions.

Output Characteristics: 3-STATE

3-STATE output allows for tristate operation, enabling multiple drivers to share a common bus.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides corrosion resistance and ensures long-term reliability of connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connection options for the bus driver & transceiver.

No. of Ports: 2

Dual ports allow for multiple connections and expand the functionality of the bus driver & transceiver.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75 mm enables compact and low-profile designs for space-constrained applications.

Width: 3.9 mm

Narrow width of 3.9 mm allows for efficient use of space on the circuit board and compact layout designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other devices in the system.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage of 4.5V ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and assembly of the bus driver & transceiver.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for robust soldering and assembly processes for the bus driver & transceiver.

Length: 8.65 mm

Compact length of 8.65 mm enables space-saving integration of the bus driver & transceiver in tight layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature operation ensures reliability and performance in harsh industrial environments.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies to provide high speed and low power consumption in the bus driver & transceiver.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and reliable solder connections for the bus driver & transceiver.

Packing Method: TUBE

Tube packing method ensures safe transportation and storage of the bus driver & transceiver during handling and shipping.

Terminal Pitch: 1.27 mm

Optimal terminal pitch of 1.27 mm provides easy access and connection to external components and interfaces.

Control Type: ENABLE HIGH

Enable high control type allows for easy configuration and control of the bus driver & transceiver in the system.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage of 5.5V ensures safe operation and protects the bus driver & transceiver from overvoltage conditions.

Maximum Power Supply Current (ICC): 51 mA

Low maximum power supply current of 51 mA minimizes power consumption and enhances the efficiency of the bus driver & transceiver.

Technical Specifications

Bus Driver & Transceivers SN64BCT126ADG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION

Control Type:

ENABLE HIGH

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

51 mA

Propagation Delay At Nominal Supply:

7.7 ns

Propagation Delay (tpd):

7.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN64BCT126ADG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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