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SN64BCT126ADRG4

Texas Instruments

SN64BCT126ADRG4 by Texas Instruments

SN64BCT126ADRG4 by Texas Instruments is a 14-terminal bus driver with 7.7ns propagation delay at 5V, suitable for industrial applications. It features 3-STATE output characteristics, operates b/w -40 to 85°C, and has a max power supply current of 51mA. The package style is small outline with gull wing terminals for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,842 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,842

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Digiode

USA . 3,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 257 parts In-Stock

1+ parts

$6.738

100+ parts

-

1k+ parts

$6.468

10k+ parts

$6.468

257

$6.738

-

$6.468

$6.468

Parana Technologies

USA . 1,717 parts In-Stock

1+ parts

$10.664

100+ parts

-

1k+ parts

$11.155

10k+ parts

-

1,717

$10.664

-

$11.155

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DigiPath Technology Company

USA . 1,213 parts In-Stock

1+ parts

$11.742

100+ parts

$10.803

1k+ parts

-

10k+ parts

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1,213

$11.742

$10.803

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ChromeModa Solutions

Germany . 3,180 parts In-Stock

1+ parts

$11.982

100+ parts

$9.825

1k+ parts

-

10k+ parts

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3,180

$11.982

$9.825

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$11.982

100+ parts

$11.383

1k+ parts

$10.784

10k+ parts

-

961

$11.982

$11.383

$10.784

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AZTECH Wire

Italy . 689 parts In-Stock

1+ parts

$16.293

100+ parts

-

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689

$16.293

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One Stop Electronics

USA . 446 parts In-Stock

1+ parts

$43.000

100+ parts

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446

$43.000

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Corphita

USA . 1,505 parts In-Stock

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1,505

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Overview

Unleash the power of seamless data transfer with the SN64BCT126ADRG4 by Texas Instruments. Crafted with precision and excellence, this bus driver & transceiver is designed to elevate your electronic projects to new heights. Perfect for a wide range of applications, this product offers unrivaled value and benefits. Trust in Texas Instruments' reputation for quality and innovation, and experience the advantage of reliable performance and efficiency with the SN64BCT126ADRG4. Upgrade your projects today and discover the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver and transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 7.7 ns

Offers fast response time for signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supplies, making it easy to integrate this product into existing systems.

Load Capacitance (CL): 50 pF

Optimized for handling capacitance in the circuit, ensuring stable and reliable signal transmission.

Maximum Operating Temperature: 85 °C

Can operate efficiently in various environmental conditions, providing versatility for different applications.

Output Characteristics: 3-STATE

Allows for tri-state outputs, providing flexibility in controlling signal flow and minimizing power consumption.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power consumption and high-speed performance, making it suitable for modern communication systems.

Technical Specifications

Bus Driver & Transceivers SN64BCT126ADRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION

Control Type:

ENABLE HIGH

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

51 mA

Propagation Delay At Nominal Supply:

7.7 ns

Propagation Delay (tpd):

7.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN64BCT126ADRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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