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SN64BCT245DWG4

Texas Instruments

SN64BCT245DWG4 by Texas Instruments

SN64BCT245DWG4 by Texas Instruments is an 8-bit bus driver with 7 ns propagation delay, suitable for bidirectional applications. It operates at a nominal voltage of 5V and has a max power supply current of 90mA. With a small outline package style, it is ideal for industrial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,500 parts In-Stock

1+ parts

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4,500

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Digiode

USA . 3,851 parts In-Stock

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3,851

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Distributors (Availability)

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Andel Nordic

Denmark . 3,568 parts In-Stock

1+ parts

$1.462

100+ parts

-

1k+ parts

$1.403

10k+ parts

$1.403

3,568

$1.462

-

$1.403

$1.403

Ampacity Inc.

Singapore . 1,008 parts In-Stock

1+ parts

$4.000

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1,008

$4.000

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One Stop Electronics

USA . 731 parts In-Stock

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$11.000

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731

$11.000

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AZTECH Wire

Italy . 190 parts In-Stock

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$14.018

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190

$14.018

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Parana Technologies

USA . 210 parts In-Stock

1+ parts

$17.061

100+ parts

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1k+ parts

$17.283

10k+ parts

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210

$17.061

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$17.283

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ChromeModa Solutions

Germany . 6,879 parts In-Stock

1+ parts

$19.170

100+ parts

$15.719

1k+ parts

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6,879

$19.170

$15.719

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IDEA Electronic Components Group

UK . 937 parts In-Stock

1+ parts

$19.170

100+ parts

$18.212

1k+ parts

$17.253

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937

$19.170

$18.212

$17.253

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Corphita

USA . 4,945 parts In-Stock

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Microchip USA

USA . 1,852 parts In-Stock

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1,852

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DigiPath Technology Company

USA . 1,489 parts In-Stock

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$17.284

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1,489

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$17.284

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Overview

Experience seamless data transmission with the Texas Instruments SN64BCT245DWG4 Bus Driver & Transceivers. Manufactured by a trusted industry leader, this product offers reliable performance and durability. Perfect for a wide range of applications, this bus driver ensures efficient communication between different parts of your system. With a compact design and advanced technology, the SN64BCT245DWG4 provides value, benefits, and advantages that will enhance your overall user experience. Upgrade your system today with this high-quality product from Texas Instruments.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product ideal for portable and rugged applications.

Propagation Delay At Nominal Supply - 7 ns

Low propagation delay ensures fast signal transmission, making the product suitable for high-speed data communication.

Surface Mount - YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Nominal Supply Voltage / Vsup (V) - 5

Operates at a common 5V supply voltage, compatible with most digital systems.

Output Characteristics - 3-STATE

3-STATE output allows for high flexibility in controlling the output signal, enabling multiple devices to share the same bus line.

Temperature Grade - INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh environments and industrial settings.

Control Type - COMMON CONTROL

Common control feature simplifies the interface and operation of the product, making it user-friendly and easy to integrate into existing systems.

Technical Specifications

Bus Driver & Transceivers SN64BCT245DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

DIRECTION CONTROL; IOL = 24MA @ VOL = 0.5V & IOH = 3MA @ VOH = 2.4V FOR PORT A

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN64BCT245DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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