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SN54HC373VTDG2

Texas Instruments

SN54HC373VTDG2 by Texas Instruments

SN54HC373VTDG2 by Texas Instruments is an 8-bit bus driver with 3-STATE output characteristics. It operates on a supply voltage range of 2V to 6V, making it suitable for various applications requiring unidirectional data flow. This CMOS technology chip comes in a surface-mount rectangular package with 22 terminals, ideal for use in electronic systems needing efficient signal transmission.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,978 parts In-Stock

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Digiode

USA . 2,352 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 3,703 parts In-Stock

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$5.017

100+ parts

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$4.816

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$4.816

3,703

$5.017

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$4.816

$4.816

AZTECH Wire

Italy . 668 parts In-Stock

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$5.466

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Parana Technologies

USA . 1,666 parts In-Stock

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$20.034

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$19.965

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DigiPath Technology Company

USA . 2,013 parts In-Stock

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$22.060

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$22.060

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ChromeModa Solutions

Germany . 995 parts In-Stock

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$22.510

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$18.458

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$22.510

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IDEA Electronic Components Group

UK . 586 parts In-Stock

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$22.510

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$21.384

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$20.259

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One Stop Electronics

USA . 974 parts In-Stock

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$60.000

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Microchip USA

USA . 1,867 parts In-Stock

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$114.490

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$111.430

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$109.910

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$108.380

1,867

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$108.380

Corphita

USA . 3,106 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the SN54HC373VTDG2 by Texas Instruments, a leading manufacturer in the industry. This bus driver and transceiver is designed to provide seamless communication between multiple devices, making it an essential component for a wide range of applications. With its 3-state output characteristics and CMOS technology, this product ensures optimal performance and efficiency. Trust in Texas Instruments to deliver top-notch solutions that will elevate your projects to new heights. Invest in the SN54HC373VTDG2 today and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of the bus driver & transceiver on a circuit board, saving space and reducing overall size of the device.

No. of Functions: 8

Having 8 functions provides versatility and flexibility in managing and controlling multiple bus interfaces efficiently.

Package Shape: RECTANGULAR

Rectangular package shape makes it easier to mount and integrate the bus driver & transceiver into a variety of circuit designs while maximizing available board space.

No. of Bits: 8

8-bit functionality ensures compatibility with a wide range of systems and devices, enhancing the overall connectivity and communication capabilities of the product.

No. of Terminals: 22

With 22 terminals, the bus driver & transceiver offers ample connectivity options, enabling seamless integration into complex circuitry and communication networks.

Package Style (Meter): UNCASED CHIP

Uncased chip package style provides cost-effective and efficient packaging solution, suitable for applications where minimal size and weight are crucial.

Output Characteristics: 3-STATE

3-state output characteristics allow for the bus driver & transceiver to control the bus lines effectively, enabling high-speed data transfer and signal integrity management.

Terminal Position: UPPER

Upper terminal position facilitates easy access and connection to other components or devices, simplifying installation and maintenance process.

No. of Ports: 2

Having 2 ports enhances the flexibility and scalability of the bus driver & transceiver, enabling multiple connections and data routing options.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage requirement of 2V ensures energy efficiency and compatibility with a wide range of power sources, making it suitable for battery-powered devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speed, making the bus driver & transceiver energy-efficient and reliable in data transmission.

Terminal Form: NO LEAD

No lead terminal form simplifies the assembly process and reduces the risk of short circuits, ensuring long-term performance and durability of the bus driver & transceiver.

Packing Method: TUBE

Tube packing method provides secure and convenient storage and transportation of the bus driver & transceiver, ensuring protection against external damage and ease of handling during manufacturing.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies data flow management and control, enhancing the overall efficiency and reliability of data transmission within the system.

Maximum Supply Voltage (Vsup): 6V

High maximum supply voltage tolerance of 6V ensures compatibility with a variety of power sources and protection against voltage fluctuations, enhancing the overall robustness and reliability of the bus driver & transceiver.

Technical Specifications

Bus Driver & Transceivers SN54HC373VTDG2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Count Direction:

UNIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-XUUC-N22

Logic IC Type:

No. of Bits:

8

No. of Functions:

8

No. of Ports:

2

No. of Terminals:

22

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trade Compliance

SN54HC373VTDG2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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