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SN54HC373VTDG1

Texas Instruments

SN54HC373VTDG1 by Texas Instruments

SN54HC373VTDG1 by Texas Instruments is an 8-bit bus driver with 3-STATE output characteristics. It operates on a supply voltage range of 2V to 6V, making it suitable for various CMOS technology applications. With two ports and unidirectional count direction, this surface-mount chip is ideal for compact designs requiring efficient data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,392 parts In-Stock

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3,392

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Digiode

USA . 2,282 parts In-Stock

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2,282

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Distributors (Availability)

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One Stop Electronics

USA . 758 parts In-Stock

1+ parts

$4.000

100+ parts

-

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758

$4.000

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Andel Nordic

Denmark . 5,162 parts In-Stock

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$5.104

100+ parts

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$4.900

10k+ parts

$4.900

5,162

$5.104

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$4.900

$4.900

AZTECH Wire

Italy . 540 parts In-Stock

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$16.359

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540

$16.359

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Parana Technologies

USA . 1,440 parts In-Stock

1+ parts

$29.803

100+ parts

$2,767.618

1k+ parts

$26.822

10k+ parts

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1,440

$29.803

$2,767.618

$26.822

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DigiPath Technology Company

USA . 1 parts In-Stock

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$32.816

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1

$32.816

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ChromeModa Solutions

Germany . 2,556 parts In-Stock

1+ parts

$33.486

100+ parts

$27.459

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2,556

$33.486

$27.459

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IDEA Electronic Components Group

UK . 2,094 parts In-Stock

1+ parts

$33.486

100+ parts

$31.812

1k+ parts

$30.137

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2,094

$33.486

$31.812

$30.137

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Ampacity Inc.

Singapore . 371 parts In-Stock

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$60.000

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371

$60.000

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Corphita

USA . 2,351 parts In-Stock

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Overview

Enhance your circuit designs with the SN54HC373VTDG1 by Texas Instruments, a top-of-the-line bus driver & transceiver. With a reputation for superior quality and reliability, Texas Instruments delivers a product that exceeds expectations. This versatile chip offers 8 functions, 3-state output characteristics, and a wide supply voltage range, making it ideal for a variety of applications. Upgrade your projects with the SN54HC373VTDG1 and experience the unmatched value and benefits it brings to your designs.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and convenient mounting onto a circuit board, saving space and making it suitable for compact designs.

No. of Functions: 8

With 8 functions, this product can handle multiple tasks efficiently, making it versatile and ideal for bus driver and transceiver applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to handle and integrate into designs, providing a standard form factor for compatibility with other components.

No. of Bits: 8

With 8 bits, this product can process and transmit data in 8-bit chunks, providing sufficient resolution and accuracy for various communication tasks.

No. of Terminals: 22

Having 22 terminals allows for multiple connections and interfaces, enabling versatile connectivity options and compatibility with different systems.

Output Characteristics: 3-STATE

The 3-state output allows the product to drive the bus lines actively high, actively low, or float (high impedance), providing flexibility in controlling the bus signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for long-term use.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2V ensures compatibility with low-voltage systems and allows for efficient power management.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this product can handle higher voltage inputs while maintaining stable performance, offering versatility in different operating conditions.

Technical Specifications

Bus Driver & Transceivers SN54HC373VTDG1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Count Direction:

UNIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-XUUC-N22

Logic IC Type:

No. of Bits:

8

No. of Functions:

8

No. of Ports:

2

No. of Terminals:

22

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trade Compliance

SN54HC373VTDG1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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