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SN54HC157J

Texas Instruments

SN54HC157J by Texas Instruments

SN54HC157J by Texas Instruments is a CMOS multiplexer with 4 functions and 2 inputs. It has a propagation delay of 32 ns at 5V, making it ideal for military-grade applications requiring fast signal switching. With a package style of IN-LINE and through-hole terminal form, this device offers reliable performance in harsh environments.

Median Price

$14.850

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 198 parts In-Stock

1+ parts

-

100+ parts

$11.880

1k+ parts

$10.630

10k+ parts

$10.000

198

-

$11.880

$10.630

$10.000

DigiKey

USA . 198 parts In-Stock

1+ parts

-

100+ parts

$15.630

1k+ parts

-

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198

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$15.630

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Verical

USA . 198 parts In-Stock

1+ parts

-

100+ parts

$14.850

1k+ parts

$13.287

10k+ parts

$12.500

198

-

$14.850

$13.287

$12.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,464 parts In-Stock

1+ parts

$10.896

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3,464

$10.896

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Bristol Electronics

USA . 10 parts In-Stock

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$13.524

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10

$13.524

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Vyrian

USA . 6,527 parts In-Stock

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6,527

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Holdelec - ElecDif-Pro

France . 325 parts In-Stock

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325

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Sogenti Electronics

Canada . 169 parts In-Stock

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ABC Electronics Ltd.

UK . 63 parts In-Stock

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LWI Electronics Inc

India . 53 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 17 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Dan-Mar Components

USA . 10 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,524 parts In-Stock

1+ parts

$7.515

100+ parts

$697.897

1k+ parts

$6.764

10k+ parts

-

1,524

$7.515

$697.897

$6.764

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DigiPath Technology Company

USA . 1,104 parts In-Stock

1+ parts

$8.275

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1,104

$8.275

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IDEA Electronic Components Group

UK . 783 parts In-Stock

1+ parts

$8.444

100+ parts

$8.022

1k+ parts

$7.600

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-

783

$8.444

$8.022

$7.600

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ChromeModa Solutions

Germany . 582 parts In-Stock

1+ parts

$8.444

100+ parts

$6.924

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582

$8.444

$6.924

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Component Stockers USA

USA . 475 parts In-Stock

1+ parts

$10.200

100+ parts

$9.590

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475

$10.200

$9.590

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Corphita

USA . 2,164 parts In-Stock

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$10.323

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$10.323

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Infinite Electronics LLP (Excess)

. 439 parts In-Stock

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439

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Perfect Parts

USA . 165 parts In-Stock

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A-Z Elektronik GmbH

Germany . 128 parts In-Stock

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128

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Assy Fe

Spain . 17 parts In-Stock

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Overview

Experience superior performance and reliability with the Texas Instruments SN54HC157J multiplexer & demultiplexer. Trusted by professionals worldwide, Texas Instruments delivers cutting-edge technology and quality products. The SN54HC157J offers seamless integration, fast propagation delay, and versatile applications in various industries. Unlock endless possibilities and streamline your projects with this high-quality component that guarantees efficiency and precision. Transform your designs with Texas Instruments SN54HC157J today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay allows for fast signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

No. of Functions: 4

Having multiple functions in one device saves space and reduces the need for additional components, making the overall system more efficient.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, making it compatible with a wide range of systems and easy to integrate.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environments or industrial applications.

Technical Specifications

Multiplexer & Demultiplexer SN54HC157J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

290 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54HC157J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-259-8918, 5962012598918, 5962-01-319-4627, 5962013194627

NIIN

012598918, 013194627

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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