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SN54HC132TDG2

Texas Instruments

SN54HC132TDG2 by Texas Instruments

SN54HC132TDG2 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. Operating voltage range from 2V to 6V, it has a max output current of 4A. Suitable for surface mount applications in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,583 parts In-Stock

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Digiode

USA . 91 parts In-Stock

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91

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AZTECH Wire

Italy . 598 parts In-Stock

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$6.158

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598

$6.158

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Parana Technologies

USA . 734 parts In-Stock

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$14.232

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$14.683

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734

$14.232

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DigiPath Technology Company

USA . 2,356 parts In-Stock

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$15.671

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$15.671

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ChromeModa Solutions

Germany . 4,807 parts In-Stock

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$15.991

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$13.113

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IDEA Electronic Components Group

UK . 539 parts In-Stock

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$15.991

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$15.191

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$14.392

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539

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One Stop Electronics

USA . 994 parts In-Stock

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$63.000

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994

$63.000

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Component Stockers USA

USA . 467 parts In-Stock

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$99.990

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Microchip USA

USA . 2,714 parts In-Stock

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$106.420

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$104.570

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$103.650

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$102.720

2,714

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$104.570

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$102.720

Corphita

USA . 1,752 parts In-Stock

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Overview

The SN54HC132TDG2 by Texas Instruments is a top-quality logic gate that offers unmatched performance and reliability. With 4 functions and 2 inputs, this surface-mount chip is perfect for a variety of applications. Texas Instruments is known for its cutting-edge technology and innovation, making this product a must-have for any project. Whether you're working on a DIY electronics project or a complex circuit design, the SN54HC132TDG2 delivers exceptional value and benefits. Upgrade your work with this high-quality logic gate today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount design makes it easy to integrate into electronic circuits, saving space and allowing for automated assembly.

No. of Functions: 4

Having 4 functions in one package reduces the number of components needed in a circuit, simplifying the design and reducing overall costs.

No. of Inputs: 2

With 2 inputs per function, this logic gate provides versatility in logic operations and can be used for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V is common in many electronic systems, making this logic gate compatible with a wide range of applications.

No. of Terminals: 14

Having 14 terminals allows for connectivity with other components in a circuit, making it versatile and adaptable to different circuit configurations.

Maximum I (ol): 4 Amp

The high maximum output current capability of 4 Amps ensures that this logic gate can drive heavy loads without the need for additional buffering.

Minimum Supply Voltage (Vsup): 2 V

Being able to operate at a minimum supply voltage of 2V allows for flexibility in power supply requirements, making it suitable for low power applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy efficient and reliable in noisy environments.

Maximum Supply Voltage (Vsup): 6 V

Having a maximum supply voltage of 6V ensures that the logic gate can withstand voltage spikes or fluctuations, enhancing its overall robustness.

Technical Specifications

Logic Gates SN54HC132TDG2 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-XUUC-N14

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN54HC132TDG2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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