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SN54F02J

Texas Instruments

SN54F02J by Texas Instruments

SN54F02J by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 6.5 ns at 5V, making it suitable for military-grade applications requiring fast response times. With a max operating temperature of 125°C and low power consumption (13mA), it is ideal for high-performance electronic systems in harsh environments.

Median Price

$10.106

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 25 parts In-Stock

1+ parts

-

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$10.106

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$9.630

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25

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$10.106

$9.630

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Distributors (In-Stock)

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NAC Semi

USA . 28 parts In-Stock

1+ parts

$8.980

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$8.980

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Digiode

USA . 3,521 parts In-Stock

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$10.697

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Vyrian

USA . 4,538 parts In-Stock

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Electronic Expediters

USA . 114 parts In-Stock

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TME

Poland . 43 parts In-Stock

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$14.779

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$14.779

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Manotoh

Italy . 25 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 18 parts In-Stock

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Resion

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Distributors (Availability)

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Ampacity Inc.

Singapore . 25 parts In-Stock

1+ parts

$8.590

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25

$8.590

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AZTECH Wire

Italy . 529 parts In-Stock

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$10.090

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529

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Corphita

USA . 2,202 parts In-Stock

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$10.134

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Parana Technologies

USA . 605 parts In-Stock

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$27.704

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$38.966

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$27.704

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Microchip USA

USA . 1,051 parts In-Stock

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$29.230

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$28.810

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$28.610

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$28.400

1,051

$29.230

$28.810

$28.610

$28.400

DigiPath Technology Company

USA . 2,108 parts In-Stock

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$30.505

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$30.505

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ChromeModa Solutions

Germany . 6,042 parts In-Stock

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$31.128

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$25.525

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$31.128

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IDEA Electronic Components Group

UK . 1,464 parts In-Stock

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$31.128

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$29.572

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$28.015

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Assy Fe

Spain . 90 parts In-Stock

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Kepictronics

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FE SAS

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Overview

Discover the superior quality and reliability of Texas Instruments with the SN54F02J Logic Gates. This versatile component offers customers fast propagation delay, low power consumption, and exceptional performance in a wide range of applications. Whether you're designing consumer electronics, industrial controls, or automotive systems, this innovative product will meet your needs with precision and efficiency. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Elevate your designs with the SN54F02J today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and resistance to temperature extremes, making the product reliable in harsh operating conditions.

Propagation Delay At Nominal Supply: 7.5 ns

The low propagation delay ensures fast signal processing, making the product ideal for applications that require quick response times.

No. of Functions: 4

With multiple functions available in a single component, this product offers versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage simplifies design compatibility and integration within existing systems.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of devices and systems, enhancing the product's versatility and usability.

Technical Specifications

Logic Gates SN54F02J attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

13 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54F02J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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