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SCAN926260TUFX/NOPB

Texas Instruments

SCAN926260TUFX/NOPB by Texas Instruments

SCAN926260TUFX/NOPB by Texas Instruments is a Line Receiver with 6 functions, operating at 3.3V. It features a 196-terminal grid array package suitable for industrial applications. With a temperature range of -40 to 85°C and output polarity as TRUE, it offers reliable performance in various environments.

Median Price

$26.433

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$26.154

100+ parts

$23.248

1k+ parts

$17.094

10k+ parts

-

950

$26.154

$23.248

$17.094

-

Rochester

USA . 14,994 parts In-Stock

1+ parts

-

100+ parts

$21.370

1k+ parts

$19.120

10k+ parts

$17.990

14,994

-

$21.370

$19.120

$17.990

DigiKey

USA . 14,994 parts In-Stock

1+ parts

-

100+ parts

$28.110

1k+ parts

-

10k+ parts

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14,994

-

$28.110

-

-

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$26.712

1k+ parts

$23.900

10k+ parts

$22.488

5,000

-

$26.712

$23.900

$22.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,243 parts In-Stock

1+ parts

$22.553

100+ parts

-

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-

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-

4,243

$22.553

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-

-

DigiKey Marketplace

USA . 14,994 parts In-Stock

1+ parts

-

100+ parts

-

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14,994

-

-

-

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Vyrian

USA . 6,608 parts In-Stock

1+ parts

-

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6,608

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-

-

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Chip Stock

USA . 5,460 parts In-Stock

1+ parts

-

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5,460

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Bristol Electronics

USA . 339 parts In-Stock

1+ parts

-

100+ parts

-

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339

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,287 parts In-Stock

1+ parts

$7.245

100+ parts

-

1k+ parts

$7.747

10k+ parts

-

1,287

$7.245

-

$7.747

-

DigiPath Technology Company

USA . 469 parts In-Stock

1+ parts

$7.978

100+ parts

$7.340

1k+ parts

-

10k+ parts

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469

$7.978

$7.340

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-

ChromeModa Solutions

Germany . 5,595 parts In-Stock

1+ parts

$8.141

100+ parts

$6.676

1k+ parts

-

10k+ parts

-

5,595

$8.141

$6.676

-

-

IDEA Electronic Components Group

UK . 1,285 parts In-Stock

1+ parts

$8.141

100+ parts

-

1k+ parts

$7.327

10k+ parts

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1,285

$8.141

-

$7.327

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Corphita

USA . 1,979 parts In-Stock

1+ parts

$21.366

100+ parts

-

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1,979

$21.366

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QUARKTWIN TECHNOLOGY LTD

USA . 19,297 parts In-Stock

1+ parts

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19,297

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A-Z Elektronik GmbH

Germany . 6,602 parts In-Stock

1+ parts

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6,602

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,000

-

-

-

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Perfect Parts

USA . 2,016 parts In-Stock

1+ parts

-

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2,016

-

-

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Metaverse IC Inc.

Canada . 575 parts In-Stock

1+ parts

-

100+ parts

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575

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-

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Kepictronics

USA . 475 parts In-Stock

1+ parts

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475

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Overview

Enhance your electronics projects with the SCAN926260TUFX/NOPB from Texas Instruments, a leading manufacturer known for high-quality components. As a line driver and receiver, this product offers seamless communication and reliable data transmission. With its durable plastic/epoxy construction and compact square package shape, it's perfect for various applications. Experience the value of 6 functions in one device, with a wide operating temperature range and low power consumption. Trust Texas Instruments for top-notch performance and innovation in every project. Elevate your creations with the SCAN926260TUFX/NOPB today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 6

Having 6 functions in one device reduces the need for multiple components, simplifying the design and manufacturing process.

Maximum Supply Voltage-1: 3.6 V

Support for a maximum supply voltage of 3.6 V ensures compatibility with various power sources, offering flexibility in system integration.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the device to withstand harsh environmental conditions, increasing its robustness.

Technical Specifications

Line Drivers & Receivers SCAN926260TUFX/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Interface IC Type:

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.47 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

600 mA

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

SCAN926260TUFX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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