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SCAN921226HSMX/NOPB

Texas Instruments

SCAN921226HSMX/NOPB by Texas Instruments

SCAN921226HSMX/NOPB by Texas Instruments is a Line Receiver IC with 49 terminals, operating at 3.3V. It has a max supply current of 120mA and can withstand temperatures from -40 to 125°C. Ideal for automotive applications due to its fine pitch grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,314 parts In-Stock

1+ parts

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4,314

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Vyrian

USA . 3,210 parts In-Stock

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3,210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 567 parts In-Stock

1+ parts

$6.756

100+ parts

-

1k+ parts

$7.424

10k+ parts

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567

$6.756

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$7.424

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DigiPath Technology Company

USA . 2,333 parts In-Stock

1+ parts

$7.439

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2,333

$7.439

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ChromeModa Solutions

Germany . 3,401 parts In-Stock

1+ parts

$7.591

100+ parts

$6.225

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3,401

$7.591

$6.225

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IDEA Electronic Components Group

UK . 1,512 parts In-Stock

1+ parts

$7.591

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$6.832

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1,512

$7.591

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$6.832

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AZTECH Wire

Italy . 781 parts In-Stock

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$9.573

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781

$9.573

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One Stop Electronics

USA . 1,536 parts In-Stock

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$36.500

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1,536

$36.500

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Component Stockers USA

USA . 324 parts In-Stock

1+ parts

$99.990

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324

$99.990

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Corphita

USA . 4,574 parts In-Stock

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Microchip USA

USA . 106 parts In-Stock

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106

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Overview

Enhance the performance of your electronic systems with the Texas Instruments SCAN921226HSMX/NOPB line driver & receiver. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in every product. This versatile component is ideal for automotive applications, offering seamless communication and efficient data transmission. With its advanced features and durable construction, this line driver & receiver provides unmatched value and performance for your projects. Trust Texas Instruments to deliver excellence in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB.

Package Shape: SQUARE

The square shape allows for efficient packing and utilization of space on the PCB.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V allows for compatibility with a wide range of systems.

No. of Terminals: 49

Having a high number of terminals enables versatile connectivity and functionality.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies PCB layout and allows for easy routing of traces.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time ensures quick and efficient soldering during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for proper soldering of the components without damaging them.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means that this product meets the stringent requirements for reliability in automotive applications.

Maximum Receive Delay: 0 ns

The zero receive delay ensures immediate and accurate data transmission.

Terminal Form: BALL

The ball terminal form provides reliable connections and easy alignment during installation.

Maximum Supply Current: 120 mA

With a maximum supply current of 120mA, this product operates efficiently without drawing excessive power.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent operation.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and compact PCB design.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that this product can withstand moderate exposure to moisture during handling and storage.

Interface IC Type: LINE RECEIVER

Featuring a line receiver interface IC type, this product is designed for reliable signal reception and processing.

Technical Specifications

Line Drivers & Receivers SCAN921226HSMX/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

49

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

120 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SCAN921226HSMX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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