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RM48L950DPGET

Texas Instruments

RM48L950DPGET by Texas Instruments

Texas Instruments RM48L950DPGET microcontroller features 32-bit CPU, 22-bit address bus, and 64K data EEPROM. Ideal for industrial applications with CAN, Ethernet, I2C, SPI connectivity and 24-Ch 12-Bit ADCs. Operates at -40 to 105 °C with max clock frequency of 80 MHz.

Median Price

$28.493

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 520 parts In-Stock

1+ parts

$28.493

100+ parts

$25.327

1k+ parts

$18.623

10k+ parts

-

520

$28.493

$25.327

$18.623

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,407 parts In-Stock

1+ parts

$27.068

100+ parts

-

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-

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3,407

$27.068

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Vyrian

USA . 9,221 parts In-Stock

1+ parts

-

100+ parts

-

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9,221

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 230 parts In-Stock

1+ parts

$10.190

100+ parts

-

1k+ parts

-

10k+ parts

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230

$10.190

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-

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Ampacity Inc.

Singapore . 86 parts In-Stock

1+ parts

$24.220

100+ parts

-

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86

$24.220

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-

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Corphita

USA . 1,112 parts In-Stock

1+ parts

$25.644

100+ parts

-

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1,112

$25.644

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-

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Parana Technologies

USA . 75 parts In-Stock

1+ parts

$55.599

100+ parts

-

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75

$55.599

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ChromeModa Solutions

Germany . 6,871 parts In-Stock

1+ parts

$62.471

100+ parts

$51.226

1k+ parts

-

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6,871

$62.471

$51.226

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IDEA Electronic Components Group

UK . 1,955 parts In-Stock

1+ parts

$62.471

100+ parts

$59.347

1k+ parts

$56.224

10k+ parts

-

1,955

$62.471

$59.347

$56.224

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DigiPath Technology Company

USA . 1,522 parts In-Stock

1+ parts

-

100+ parts

$56.324

1k+ parts

-

10k+ parts

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1,522

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$56.324

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Overview

Experience unmatched performance and reliability with the RM48L950DPGET by Texas Instruments, a leading manufacturer in the field of microcontrollers. Perfect for a wide range of applications, this high-quality product offers customers exceptional value and benefits. With advanced features like ADC and DMA channels, along with connectivity options like CAN, Ethernet, and USB, this microcontroller is designed to meet all your needs. Trust Texas Instruments to deliver top-notch technology that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Clock Frequency: 80 MHz

High clock frequency allows for faster processing speeds and improved overall performance.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to read analog signals, increasing its versatility in handling different types of input.

Connectivity: CAN(3), ETHERNET, I2C, SPI(3), UART(2), USB(2)

Multiple connectivity options allow for seamless integration with other devices and systems, enhancing the product's functionality and versatility.

RAM Bytes: 262144

Large RAM size enables the microcontroller to store and process a significant amount of data, improving its multitasking capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and streamlined processing, optimizing the performance of the microcontroller.

Technical Specifications

Microcontrollers RM48L950DPGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SPI(3), UART(2), USB(2)

Peripherals:

DMA(16), POR, TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM48L950DPGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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