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PTMUX8212PWR

Texas Instruments

PTMUX8212PWR by Texas Instruments

PTMUX8212PWR by Texas Instruments is a CMOS SPST multiplexer with 4 channels, 16 terminals, and a supply voltage range of ±10V to ±50V. It offers a bandwidth of 420 kHz, on-state resistance of 10 ohm, and off-state isolation of 90 dB. Ideal for applications requiring high-speed signal switching in compact designs with low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,915 parts In-Stock

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Digiode

USA . 3,128 parts In-Stock

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Nova Conductors

Japan . 37 parts In-Stock

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One Stop Electronics

USA . 560 parts In-Stock

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$0.500

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560

$0.500

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Semicontronic

India . 197 parts In-Stock

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$0.500

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$0.488

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$0.485

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197

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Parana Technologies

USA . 1,453 parts In-Stock

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$2.059

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$191.169

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$1.853

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DigiPath Technology Company

USA . 889 parts In-Stock

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$2.267

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ChromeModa Solutions

Germany . 2,067 parts In-Stock

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$2.313

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$1.897

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IDEA Electronic Components Group

UK . 1,804 parts In-Stock

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$2.313

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$2.082

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Ampacity Inc.

Singapore . 713 parts In-Stock

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$6.500

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Corohmni

South Africa . 472 parts In-Stock

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AZTECH Wire

Italy . 653 parts In-Stock

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Continental Prestige Electronics

USA . 5,139 parts In-Stock

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Corphita

USA . 3,371 parts In-Stock

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Argo Parts USA

USA . 2,705 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Upgrade your electronic projects with the PTMUX8212PWR by Texas Instruments, a top-notch multiplexer offering unparalleled quality and performance. Perfect for a variety of applications, this versatile device boasts four functions in a small outline package, making it ideal for space-constrained designs. With a wide supply voltage range and excellent temperature tolerance, this multiplexer ensures reliable operation in any environment. Trust Texas Instruments for superior products that deliver value and innovation to customers across the globe. Elevate your projects with the PTMUX8212PWR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product suitable for various applications.

No. of Functions: 4

With 4 different functions, this multiplexer & switch offers versatility and flexibility in controlling multiple channels or signals.

Nominal Supply Voltage (Vsup): 36 V

Operating at a nominal supply voltage of 36V ensures stability and efficiency in performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows the product to be used in harsh environments without compromising its functionality.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency of the multiplexer & switch.

Technical Specifications

Multiplexers & Switches PTMUX8212PWR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

420 kHz

Maximum Input Voltage:

50 V

Minimum Input Voltage:

-10 V

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Maximum Negative Supply Voltage (Vsup):

-50 V

Minimum Negative Supply Voltage (Vsup):

-10 V

Nominal Negative Supply Voltage (Vsup):

-36 V

Normal Position (V):

NO

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.2 ohm

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.1 A

Maximum Supply Current (Isup):

.35 mA

Maximum Supply Voltage (Vsup):

50 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

36 V

Surface Mount:

YES

Maximum Switch-off Time:

4000 ns

Maximum Switch-on Time:

12000 ns

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

PTMUX8212PWR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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