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PTMUX6219DGKR

Texas Instruments

PTMUX6219DGKR by Texas Instruments

SPDT; Temperature Grade: AUTOMOTIVE; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 125 Cel; Nominal Bandwidth: 43 kHz;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,811 parts In-Stock

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7,811

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Digiode

USA . 3,086 parts In-Stock

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3,086

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 560 parts In-Stock

1+ parts

$1.500

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-

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560

$1.500

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Semicontronic

India . 600 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

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$6.305

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600

$6.500

$6.338

$6.305

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Ampacity Inc.

Singapore . 693 parts In-Stock

1+ parts

$7.500

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693

$7.500

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Parana Technologies

USA . 581 parts In-Stock

1+ parts

$7.638

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$8.156

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581

$7.638

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$8.156

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DigiPath Technology Company

USA . 712 parts In-Stock

1+ parts

$8.410

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712

$8.410

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ChromeModa Solutions

Germany . 6,099 parts In-Stock

1+ parts

$8.582

100+ parts

$7.037

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6,099

$8.582

$7.037

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IDEA Electronic Components Group

UK . 453 parts In-Stock

1+ parts

$8.582

100+ parts

$8.153

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$7.724

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453

$8.582

$8.153

$7.724

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$10.503

100+ parts

$9.978

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$9.978

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100

$10.503

$9.978

$9.978

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AZTECH Wire

Italy . 842 parts In-Stock

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$13.577

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842

$13.577

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Corohmni

South Africa . 204 parts In-Stock

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$22.916

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204

$22.916

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Argo Parts USA

USA . 3,441 parts In-Stock

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3,441

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Continental Prestige Electronics

USA . 2,389 parts In-Stock

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2,389

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Corphita

USA . 2,134 parts In-Stock

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2,134

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Technical Specifications

Multiplexers & Switches PTMUX6219DGKR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

43 kHz

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Temperature Grade:

Trade Compliance

PTMUX6219DGKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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