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PTMUX1133PWR

Texas Instruments

PTMUX1133PWR by Texas Instruments

PTMUX1133PWR by Texas Instruments is a 3-function SPDT multiplexer with CMOS technology. It operates at a supply voltage range of 2.25V to 2.75V and offers a max on-state resistance of 4 ohm. Ideal for automotive applications, it features common output, break-before-make switching, and provides 45dB off-state isolation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,644 parts In-Stock

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Digiode

USA . 267 parts In-Stock

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267

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Parana Technologies

USA . 798 parts In-Stock

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$5.773

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$6.567

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798

$5.773

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$6.567

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DigiPath Technology Company

USA . 2,230 parts In-Stock

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$6.357

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$5.849

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$6.357

$5.849

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ChromeModa Solutions

Germany . 392 parts In-Stock

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$6.487

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$5.319

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392

$6.487

$5.319

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IDEA Electronic Components Group

UK . 291 parts In-Stock

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$6.487

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$5.838

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291

$6.487

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$5.838

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Ampacity Inc.

Singapore . 832 parts In-Stock

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$6.500

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832

$6.500

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One Stop Electronics

USA . 595 parts In-Stock

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$6.500

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595

$6.500

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AZTECH Wire

Italy . 268 parts In-Stock

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$6.837

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$6.837

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Continental Prestige Electronics

USA . 5,792 parts In-Stock

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Corphita

USA . 1,262 parts In-Stock

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Argo Parts USA

USA . 810 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Upgrade your electronic systems with the PTMUX1133PWR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality multiplexers and switches that are perfect for a wide range of applications. With its advanced technology and compact design, this product offers unparalleled value and benefits to customers. Improve your system performance and efficiency with the PTMUX1133PWR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and facilitating automated assembly.

No. of Functions: 3

Having multiple functions in one product provides flexibility and cost-effectiveness in circuit designs.

Nominal Supply Voltage (Vsup): 2.5 V

Operates efficiently at a standard voltage, making it compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for use in demanding environments such as automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Multiplexers & Switches PTMUX1133PWR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Maximum Negative Supply Voltage (Vsup):

-2.75 V

Minimum Negative Supply Voltage (Vsup):

-2.25 V

Nominal Negative Supply Voltage (Vsup):

-2.5 V

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

45 dB

Nominal On-state Resistance Match:

.18 ohm

Maximum On-state Resistance (Ron):

4 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

COMMON OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

.001 mA

Maximum Supply Voltage (Vsup):

2.75 V

Minimum Supply Voltage (Vsup):

2.25 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Maximum Switch-off Time:

15 ns

Maximum Switch-on Time:

22 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

PTMUX1133PWR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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