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PTMUX4052DYYR

Texas Instruments

PTMUX4052DYYR by Texas Instruments

PTMUX4052DYYR by Texas Instruments is a dual-channel CMOS multiplexer with 16 terminals. It operates at a nominal voltage of 5V and has a max bandwidth of 500 kHz. With separate outputs, it offers high off-state isolation and low on-state resistance for applications requiring precise signal switching in compact designs.

Median Price

$0.129

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$0.129

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Vyrian

USA . 7,804 parts In-Stock

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Digiode

USA . 2,235 parts In-Stock

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2,235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.126

100+ parts

-

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$0.121

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100

$0.126

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Argo Parts USA

USA . 3,919 parts In-Stock

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$0.129

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$0.125

3,919

$0.129

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$0.125

Continental Prestige Electronics

USA . 530 parts In-Stock

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$0.129

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$0.126

530

$0.129

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$0.126

Semicontronic

India . 1,288 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

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$0.485

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1,288

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$0.488

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One Stop Electronics

USA . 1,229 parts In-Stock

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$5.500

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Ampacity Inc.

Singapore . 653 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 407 parts In-Stock

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$12.029

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Corohmni

South Africa . 875 parts In-Stock

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$22.279

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Corphita

USA . 98 parts In-Stock

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Overview

Upgrade your electronic designs with the PTMUX4052DYYR by Texas Instruments, a top-quality multiplexer that offers exceptional performance and reliability. Designed by a trusted manufacturer in the industry, this versatile component is perfect for a wide range of applications in electronics and telecommunications. Experience seamless switching and high-speed performance with this advanced product that delivers excellent value and ease of use. Trust Texas Instruments to provide you with the best solutions for your technological needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material for long-lasting use.

Surface Mount:

YES - Easy installation on circuit boards.

Package Shape:

RECTANGULAR - Efficient use of space in electronic devices.

Nominal Supply Voltage (Vsup):

5 V - Compatible with standard power sources.

No. of Terminals:

16 - Supports multiple connections for versatile applications.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Compact design for space-constrained setups.

Maximum Operating Temperature:

125 °C - Ensures reliable performance in varying environments.

Minimum Operating Temperature:

55 °C - Suitable for use in extreme temperature conditions.

Terminal Position:

DUAL - Provides flexibility in connecting external components.

Output (V):

SEPARATE OUTPUT - Enables independent signal routing for enhanced functionality.

Maximum Seated Height:

1.1 mm - Low profile design for compact installations.

Width (mm):

2 mm - Slim form factor for efficient board layout.

Other IC type:

SINGLE-ENDED MULTIPLEXER - Versatile functionality for diverse applications.

Maximum On-state Resistance (Ron):

1300 ohm - Efficient signal transmission with minimal interference.

Maximum Switch-on Time:

230 ns - Quick response for seamless operation.

Length:

4.2 mm - Compact size for space-saving integration.

Maximum Switch-off Time:

160 ns - Fast switching speed for responsive performance.

Maximum Supply Current (Isup):

0.08 mA - Low power consumption for energy efficiency.

No. of Channels:

2 - Supports multiple input/output channels for expanded connectivity.

Technology:

CMOS - Reliable technology for stable operation.

Nominal Bandwidth:

500 kHz - High bandwidth for fast data transfer.

Terminal Form:

GULL WING - Secure terminal connection for stable performance.

Maximum Negative Supply Voltage (Vsup):

12 V - Accommodates a wide range of power sources.

Nominal Negative Supply Voltage (Vsup):

5 V - Suitable for negative voltage applications.

Terminal Pitch:

0.5 mm - Fine pitch for precise connections.

Maximum Supply Voltage (Vsup):

12 V - Wide voltage range for compatibility with various systems.

Maximum Signal Current:

0.01 A - Supports high current flow for robust signal transmission.

Nominal Off-state Isolation:

95 dB - Provides excellent signal isolation for clear communication.

Switching (V):

BREAK-BEFORE-MAKE - Prevents signal overlap for accurate switching.

Nominal On-state Resistance Match:

2 ohm - Consistent resistance for reliable signal transmission.

Technical Specifications

Multiplexers & Switches PTMUX4052DYYR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

500 kHz

JESD-30 Code:

R-PDSO-G16

Length:

4.2 mm

Maximum Negative Supply Voltage (Vsup):

-12 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Normal Position (V):

NO

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

95 dB

Nominal On-state Resistance Match:

2 ohm

Maximum On-state Resistance (Ron):

1300 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.13,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Signal Current:

.01 A

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

12 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

160 ns

Maximum Switch-on Time:

230 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

2 mm

Trade Compliance

PTMUX4052DYYR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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