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PTCA9536BDTMR

Texas Instruments

PTCA9536BDTMR by Texas Instruments

PTCA9536BDTMR by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 1.65V to 5.5V, suitable for automotive applications. It operates in temperatures from -40°C to 125°C and features a chip carrier package style for surface mount assembly, making it ideal for various function interface requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,174 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,174

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Digiode

USA . 711 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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711

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,104 parts In-Stock

1+ parts

$8.540

100+ parts

-

1k+ parts

$9.198

10k+ parts

-

2,104

$8.540

-

$9.198

-

ChromeModa Solutions

Germany . 5,030 parts In-Stock

1+ parts

$9.596

100+ parts

$7.869

1k+ parts

-

10k+ parts

-

5,030

$9.596

$7.869

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IDEA Electronic Components Group

UK . 1,310 parts In-Stock

1+ parts

$9.596

100+ parts

$9.116

1k+ parts

$8.636

10k+ parts

-

1,310

$9.596

$9.116

$8.636

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$16.585

100+ parts

-

1k+ parts

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10k+ parts

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597

$16.585

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One Stop Electronics

USA . 1,527 parts In-Stock

1+ parts

$26.500

100+ parts

-

1k+ parts

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10k+ parts

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1,527

$26.500

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Corphita

USA . 4,261 parts In-Stock

1+ parts

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4,261

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DigiPath Technology Company

USA . 1,693 parts In-Stock

1+ parts

-

100+ parts

$8.652

1k+ parts

-

10k+ parts

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1,693

-

$8.652

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Overview

Unlock the potential of your electronic designs with the PTCA9536BDTMR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products like this interface circuit that offers unparalleled reliability and performance. Perfect for automotive applications, this chip carrier package boasts a wide operating temperature range and a low supply voltage, making it an ideal choice for a variety of projects. Trust Texas Instruments to provide innovative solutions that add value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount compatibility allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V allows for versatility in power sources, making the IC compatible with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, fitting easily onto PCBs and saving space in electronic devices.

No. of Terminals: 8

With 8 terminals, the IC offers multiple connection points for versatile integration into circuits and systems.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers enhanced thermal performance and protection for the IC, ensuring reliability in various operating conditions.

Minimum Supply Voltage: 1.65 V

Support for a minimum supply voltage of 1.65V allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the IC can withstand high-temperature environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40°C ensures reliable performance in challenging environments, expanding the range of applications for the IC.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and allows for easy connection to other components, enhancing the ease of installation and maintenance.

Maximum Seated Height: 0.4 mm

Low seated height of 0.4mm contributes to a compact design, allowing the IC to be used in space-constrained applications.

Width: 0.8 mm

Narrow width of 0.8mm enables tight PCB layout and integration in small electronic devices, optimizing board space utilization.

Length: 1.35 mm

Compact length of 1.35mm contributes to the overall small footprint of the IC, making it suitable for miniaturized electronic designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable performance in automotive applications, where temperature fluctuations are common.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and offers environmental benefits, aligning with current industry standards.

Nominal Supply Voltage: 1.95 V

Nominal supply voltage of 1.95V provides a stable operating point for the IC, promoting consistent performance in various conditions.

Interface IC Type: INTERFACE CIRCUIT

Interface circuit type enables communication between different components or systems, enhancing the functionality and versatility of the IC.

Technical Specifications

Other Function Interface ICs PTCA9536BDTMR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PBCC-N8

Length:

1.35 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

.4 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.95 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.8 mm

Trade Compliance

PTCA9536BDTMR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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