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PTCA39306DTMR

Texas Instruments

PTCA39306DTMR by Texas Instruments

PTCA39306DTMR by Texas Instruments is an Interface IC with 2 functions, operating at a voltage range of 0.85V to 5.5V. It comes in a rectangular chip carrier package style, suitable for automotive applications due to its wide temperature range of -40°C to 125°C and no-lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,419 parts In-Stock

1+ parts

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7,419

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Connector Distribution Corp

USA . 4,873 parts In-Stock

1+ parts

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4,873

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Right Parts Inc.

USA . 4,873 parts In-Stock

1+ parts

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4,873

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Digiode

USA . 3,040 parts In-Stock

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3,040

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 687 parts In-Stock

1+ parts

$4.218

100+ parts

-

1k+ parts

$4.653

10k+ parts

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687

$4.218

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$4.653

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DigiPath Technology Company

USA . 374 parts In-Stock

1+ parts

$4.644

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374

$4.644

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ChromeModa Solutions

Germany . 5,736 parts In-Stock

1+ parts

$4.739

100+ parts

$3.886

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5,736

$4.739

$3.886

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IDEA Electronic Components Group

UK . 286 parts In-Stock

1+ parts

$4.739

100+ parts

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1k+ parts

$4.265

10k+ parts

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286

$4.739

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$4.265

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AZTECH Wire

Italy . 269 parts In-Stock

1+ parts

$8.329

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269

$8.329

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One Stop Electronics

USA . 397 parts In-Stock

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$22.500

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397

$22.500

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Corphita

USA . 1,200 parts In-Stock

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1,200

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Overview

Elevate your electronic designs with the PTCA39306DTMR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products like this interface IC that offer unparalleled performance and reliability. Ideal for a wide range of applications, this chip carrier IC boasts two functions and a very thin profile package style, making it perfect for automotive use. Customers can trust in the value and benefits of choosing Texas Instruments for their interface circuit needs. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable makes it easier to integrate this product into electronic circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this product can handle a wide range of power input levels, providing versatility in various applications.

No. of Functions: 2

Having two functions in one IC increases functionality and reduces the need for additional components, saving space and cost in the overall design.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and placement within a circuit design, optimizing space utilization.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand high temperature environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this IC suitable for use in extreme cold environments or applications that require a wide temperature range.

Temperature Grade: AUTOMOTIVE

Designed with automotive-grade components, this IC meets the stringent requirements for reliability and performance in automotive applications.

Technical Specifications

Other Function Interface ICs PTCA39306DTMR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PBCC-N8

Length:

1.35 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

.85 V

Nominal Supply Voltage:

1 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.8 mm

Trade Compliance

PTCA39306DTMR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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