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PLL1706DBQG4

Texas Instruments

PLL1706DBQG4 by Texas Instruments

PLL1706DBQG4 by Texas Instruments is a Clock Generator with 36.864 MHz output frequency, operating at -25 to 85 °C. It has 20 terminals, requires 2.7-3.6 V supply, and is ideal for video applications due to its CMOS technology and small form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,936 parts In-Stock

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Digiode

USA . 1,013 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 74 parts In-Stock

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AZTECH Wire

Italy . 673 parts In-Stock

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$12.661

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One Stop Electronics

USA . 595 parts In-Stock

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$25.000

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Parana Technologies

USA . 2,349 parts In-Stock

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$45.808

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ChromeModa Solutions

Germany . 3,560 parts In-Stock

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$51.470

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$42.205

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IDEA Electronic Components Group

UK . 1,528 parts In-Stock

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$51.470

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$48.896

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$46.323

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Corohmni

South Africa . 5,144 parts In-Stock

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Corphita

USA . 4,905 parts In-Stock

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Perfect Parts

USA . 166 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 74 parts In-Stock

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Glotronic Ltd.

UK . 59 parts In-Stock

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DigiPath Technology Company

USA . 48 parts In-Stock

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$46.405

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Overview

Elevate your projects with the PLL1706DBQG4 from Texas Instruments, a leading manufacturer known for its top-quality clock generators. Designed for a wide range of applications, this product offers unparalleled value and benefits to customers seeking reliable performance and precision timing. With a maximum output clock frequency of 36.864 MHz and a compact package style, this clock generator is ideal for various electronic devices. Trust Texas Instruments to deliver cutting-edge technology that ensures optimal functionality and efficiency in every project. Choose the PLL1706DBQG4 for exceptional results that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources, increasing versatility.

Maximum Output Clock Frequency: 36.864 MHz

The high output clock frequency allows for precise timing and synchronization in demanding applications such as video processing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range enables the product to function reliably in various environmental conditions without overheating.

Technology: CMOS

The use of CMOS technology ensures low power consumption and compatibility with a wide range of digital systems, making the product energy-efficient and versatile.

Nominal Primary Clock/Crystal Frequency: 27 MHz

The nominal clock/crystal frequency of 27 MHz provides a stable and accurate timing reference for the system, improving overall performance and reliability.

Technical Specifications

Clock Generators PLL1706DBQG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Clock Frequency:

36.864 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

PLL1706DBQG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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