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CY29412FLXIT

Infineon Technologies

CY29412FLXIT by Infineon Technologies

Infineon's CY29412FLXIT clock generator operates at a max frequency of 2100 MHz, with a supply voltage range of 1.71-1.89 V. Ideal for industrial applications, this CMOS technology chip carrier has 8 terminals and supports a primary clock frequency of 130 MHz.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 852 parts In-Stock

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Digiode

USA . 798 parts In-Stock

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Nova Conductors

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Semicontronic

India . 1,574 parts In-Stock

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$12.000

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$11.700

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$11.640

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Aztec Data Supply Inc.

USA . 2,368 parts In-Stock

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$15.413

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AZTECH Wire

Italy . 313 parts In-Stock

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Modulus Dynamics

Lithuania . 2,034 parts In-Stock

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$34.988

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$33.588

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$32.189

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Ampacity Inc.

Singapore . 152 parts In-Stock

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$35.000

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Corohmni

South Africa . 617 parts In-Stock

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Continental Prestige Electronics

USA . 5,819 parts In-Stock

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Microchip USA

USA . 3,592 parts In-Stock

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Argo Parts USA

USA . 1,805 parts In-Stock

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Authorized Procurement Solutions

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Advanced Electronics

New Zealand . 750 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 69 parts In-Stock

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Overview

Unlock the power of seamless clock generation with the CY29412FLXIT by Infineon Technologies. Crafted with precision and expertise, this clock generator is designed to deliver unparalleled performance and reliability. Ideal for a wide range of applications, this product offers customers exceptional value and benefits. Experience the advantage of high-quality clock generation with the CY29412FLXIT.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides excellent durability and reliability for the clock generator, ensuring a long lifespan.

Maximum Output Clock Frequency: 2100 MHz

The high maximum output clock frequency allows for versatile use in various applications that require fast and accurate timing.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures stability and performance even in challenging environmental conditions.

Technology: CMOS

The CMOS technology used in this clock generator provides low power consumption and high noise immunity, making it an efficient choice for electronic devices.

Nominal Primary Clock/Crystal Frequency: 130 MHz

The specified clock/crystal frequency meets industry standards, ensuring compatibility with a wide range of systems and devices.

Technical Specifications

Clock Generators CY29412FLXIT attributes and parameters. Explore more Clock Generators devices from Infineon Technologies

Specs

Additional Features:

IT ALSO OPERATES AT 2.5V OR 3.3V NOM SUPPLY

JESD-30 Code:

R-CQCC-N8

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

2100 MHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

130 MHz

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

CY29412FLXIT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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