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PLL1700E-1/2K

Texas Instruments

PLL1700E-1/2K by Texas Instruments

PLL1700E-1/2K by Texas Instruments is a clock generator with max output frequency of 33.8688 MHz, suitable for video applications. Operating voltage range from 4.5V to 5.5V, with package dimensions of 7.2mm x 5.3mm and operating temperature range of -25°C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,306 parts In-Stock

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Digiode

USA . 3,568 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 356 parts In-Stock

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$8.264

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356

$8.264

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One Stop Electronics

USA . 641 parts In-Stock

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$13.000

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641

$13.000

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Corohmni

South Africa . 1,164 parts In-Stock

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$63.567

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Parana Technologies

USA . 1,725 parts In-Stock

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$70.990

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$70.990

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DigiPath Technology Company

USA . 1,468 parts In-Stock

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$78.169

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$78.169

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ChromeModa Solutions

Germany . 876 parts In-Stock

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$79.764

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$65.406

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876

$79.764

$65.406

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IDEA Electronic Components Group

UK . 408 parts In-Stock

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$79.764

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$75.776

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$71.788

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408

$79.764

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$71.788

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A-Z Elektronik GmbH

Germany . 5,138 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Metaverse IC Inc.

Canada . 2,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 141 parts In-Stock

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Overview

Elevate your electronic designs with the PLL1700E-1/2K clock generator by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unmatched performance and reliability in a compact package. Ideal for a wide range of applications, from audio systems to industrial equipment, this clock generator ensures optimal timing and synchronization for your devices. Trust Texas Instruments to deliver cutting-edge technology that enhances the functionality of your products. Experience the value and benefits of the PLL1700E-1/2K and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the clock generator, ensuring a long lifespan and reliable performance.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and making it ideal for compact electronic devices.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in different electronic systems.

Maximum Output Clock Frequency: 33.8688 MHz

Offers a high clock frequency output, suitable for applications requiring precise timing and synchronization.

No. of Terminals: 20

Provides multiple connection points for interfacing with other electronic components, allowing for versatile usage.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable in various environments.

Nominal Primary Clock/Crystal Frequency: 27 MHz

The specific clock/crystal frequency contributes to the overall performance and compatibility of the clock generator with other devices.

Technical Specifications

Clock Generators PLL1700E-1/2K attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Clock Frequency:

33.8688 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3,5

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PLL1700E-1/2K Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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