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PLL1705DBQG4

Texas Instruments

PLL1705DBQG4 by Texas Instruments

PLL1705DBQG4 by Texas Instruments is a Clock Generator with 36.864 MHz output frequency, operating at -25 to 85 °C. It has 20 terminals, GULL WING form, and supports video applications with a supply voltage of 3.3 V. Ideal for compact designs due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,736 parts In-Stock

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Digiode

USA . 2,366 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 42 parts In-Stock

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42

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AZTECH Wire

Italy . 641 parts In-Stock

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$6.066

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641

$6.066

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One Stop Electronics

USA . 842 parts In-Stock

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$34.000

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842

$34.000

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Parana Technologies

USA . 799 parts In-Stock

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$40.720

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$40.720

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DigiPath Technology Company

USA . 550 parts In-Stock

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$44.838

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$41.251

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550

$44.838

$41.251

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ChromeModa Solutions

Germany . 1,530 parts In-Stock

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$45.753

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$37.517

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$45.753

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IDEA Electronic Components Group

UK . 839 parts In-Stock

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$45.753

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$43.465

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$41.178

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839

$45.753

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$41.178

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Corohmni

South Africa . 397 parts In-Stock

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$52.412

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Corphita

USA . 1,234 parts In-Stock

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Microchip USA

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Overview

Discover the cutting-edge PLL1705DBQG4 by Texas Instruments, a top-tier clock generator designed with precision and reliability in mind. With a focus on quality and innovation, Texas Instruments delivers unmatched performance in the field of clock generators. Ideal for a wide range of applications, this product offers customers unparalleled value and benefits. Stay ahead of the curve with the PLL1705DBQG4 and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product suitable for varied operating conditions.

Maximum Output Clock Frequency: 36.864 MHz

High maximum output clock frequency allows for efficient and precise time measurement, making this product ideal for applications requiring accurate timing.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in both hot and cold environments, making it versatile for different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the product's efficiency and reliability.

Nominal Primary Clock/Crystal Frequency: 27 MHz

Nominal primary clock/crystal frequency of 27 MHz ensures stable and consistent clock signals, making the product suitable for precision timekeeping applications.

Technical Specifications

Clock Generators PLL1705DBQG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Clock Frequency:

36.864 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

PLL1705DBQG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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