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PLL1700EG4

Texas Instruments

PLL1700EG4 by Texas Instruments

PLL1700EG4 by Texas Instruments is a Clock Generator with 33.8688 MHz output frequency, operating at -25 to 85 °C. It has 20 terminals, supports supply voltages of 3.3V and 5V, and is ideal for video applications due to its CMOS technology and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,016 parts In-Stock

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Digiode

USA . 651 parts In-Stock

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One Stop Electronics

USA . 991 parts In-Stock

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$8.000

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991

$8.000

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AZTECH Wire

Italy . 840 parts In-Stock

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$9.492

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$9.492

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Parana Technologies

USA . 756 parts In-Stock

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$25.017

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$25.706

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$27.547

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ChromeModa Solutions

Germany . 2,204 parts In-Stock

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$28.109

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$23.049

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IDEA Electronic Components Group

UK . 1,147 parts In-Stock

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$28.109

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$26.704

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$25.298

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$28.109

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Corohmni

South Africa . 582 parts In-Stock

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$68.385

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Microchip USA

USA . 1,247 parts In-Stock

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Corphita

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Overview

Discover the PLL1700EG4 by Texas Instruments, a high-quality clock generator that offers reliability and precision in various applications. With Texas Instruments' reputation for excellence in manufacturing, this product ensures superior performance and durability. Ideal for video and peripheral ICs, this clock generator provides value by delivering a maximum output clock frequency of 33.8688 MHz and operating temperatures ranging from -25°C to 85°C. Experience the benefits of seamless functionality and efficiency with the PLL1700EG4, making it the perfect choice for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can operate efficiently within a range of voltage inputs, providing flexibility in use.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Maximum Output Clock Frequency: 33.8688 MHz

High output clock frequency allows for accurate timekeeping and data synchronization.

Power Supplies (V): 3.3,5

Supports multiple power supply options for compatibility with different systems.

No. of Terminals: 20

Sufficient terminals for connecting to other components and circuitry.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space and enhances overall product compactness.

Minimum Supply Voltage: 4.5 V

Even low supply voltages can be used to operate the product effectively.

Maximum Operating Temperature: 85 °C

Can function reliably in a wide range of temperatures, suitable for various environments.

Minimum Operating Temperature: -25 °C

Operational in cold temperatures, ensuring functionality in diverse conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The finish provides excellent conductivity and corrosion resistance for long-term performance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in orientation during installation.

Maximum Seated Height: 2 mm

Low seated height allows for compact design and easy integration into tight spaces.

Width: 5.3 mm

Narrow width facilitates placement in confined areas on the circuit board.

Peak Reflow Temperature °C: 260

Resistant to high reflow temperatures during assembly processes, ensuring product integrity.

Length: 7.2 mm

Moderate length offers a balance between compactness and ease of handling.

Peripheral IC Type: CLOCK GENERATOR, VIDEO

Designed specifically for clock generation and video applications, providing optimized performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and reliability.

Maximum Supply Current: 25 mA

Efficiently manages power consumption with a maximum supply current of 25 mA.

Nominal Supply Voltage: 5 V

The nominal supply voltage is standard and widely compatible with various systems.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on the circuit board.

Nominal Primary Clock/Crystal Frequency: 27 MHz

The nominal primary clock/crystal frequency of 27 MHz suits a wide range of clocking requirements.

Technical Specifications

Clock Generators PLL1700EG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Clock Frequency:

33.8688 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PLL1700EG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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