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O917A131TRGZTQ1

Texas Instruments

O917A131TRGZTQ1 by Texas Instruments

Texas Instruments O917A131TRGZTQ1 is a Power Management IC with 48 terminals, operating at -40 to 105 °C. It has a max output voltage of 3.3 V and can handle up to 7 A current. Ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

$9.424

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,750 parts In-Stock

1+ parts

$9.535

100+ parts

$7.773

1k+ parts

$5.182

10k+ parts

-

1,750

$9.535

$7.773

$5.182

-

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$7.450

1k+ parts

$6.660

10k+ parts

$6.270

2,500

-

$7.450

$6.660

$6.270

DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$9.800

1k+ parts

-

10k+ parts

-

2,500

-

$9.800

-

-

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$9.313

1k+ parts

$8.325

10k+ parts

$7.838

2,500

-

$9.313

$8.325

$7.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,155 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,155

$0.360

-

-

-

Vyrian

USA . 3,795 parts In-Stock

1+ parts

$0.379

100+ parts

-

1k+ parts

-

10k+ parts

-

3,795

$0.379

-

-

-

DigiKey Marketplace

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,467 parts In-Stock

1+ parts

$0.341

100+ parts

-

1k+ parts

-

10k+ parts

-

3,467

$0.341

-

-

-

Parana Technologies

USA . 1,880 parts In-Stock

1+ parts

$10.569

100+ parts

-

1k+ parts

$11.070

10k+ parts

-

1,880

$10.569

-

$11.070

-

DigiPath Technology Company

USA . 558 parts In-Stock

1+ parts

$11.638

100+ parts

$10.706

1k+ parts

-

10k+ parts

-

558

$11.638

$10.706

-

-

ChromeModa Solutions

Germany . 3,044 parts In-Stock

1+ parts

$11.875

100+ parts

$9.738

1k+ parts

-

10k+ parts

-

3,044

$11.875

$9.738

-

-

IDEA Electronic Components Group

UK . 2,045 parts In-Stock

1+ parts

$11.875

100+ parts

$11.281

1k+ parts

$10.688

10k+ parts

-

2,045

$11.875

$11.281

$10.688

-

Microchip USA

USA . 1,421 parts In-Stock

1+ parts

$22.710

100+ parts

$22.390

1k+ parts

$22.230

10k+ parts

$22.070

1,421

$22.710

$22.390

$22.230

$22.070

Overview

Discover the innovative O917A131TRGZTQ1 by Texas Instruments, a top-quality Power Management IC designed to optimize energy efficiency and performance in a variety of applications. With a focus on reliability and durability, Texas Instruments is a renowned manufacturer known for delivering cutting-edge solutions. This versatile chip carrier offers a very thin profile and a wide range of features, making it ideal for industrial use. Experience the benefits of this high-performance power supply management circuit, providing adjustable thresholds, multiple outputs, and a maximum output current of 7A. Elevate your projects with Texas Instruments' O917A131TRGZTQ1 and unlock new possibilities in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to harsh environmental conditions, ensuring the longevity of the product.

Surface Mount: YES

Surface mount technology offers a compact and efficient way to mount the IC on printed circuit boards, saving space and improving overall reliability.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8V is suitable for various applications, providing a stable power source for the IC to perform efficiently.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this IC can withstand elevated temperatures without compromising performance, ideal for industrial applications.

Maximum Output Voltage: 3.3 V

The maximum output voltage of 3.3V ensures compatibility with a wide range of devices and circuits, offering flexibility in power management.

Maximum Output Current: 7 A

A high maximum output current of 7A allows this IC to power multiple components or devices simultaneously, making it suitable for high-performance applications.

Technical Specifications

Power Management ICs O917A131TRGZTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Outputs:

10

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

7 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

2700 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

O917A131TRGZTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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