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O917A152TRGZTQ1

Texas Instruments

O917A152TRGZTQ1 by Texas Instruments

O917A152TRGZTQ1 by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 105°C. It has a max output voltage of 3.3V and can handle up to 7A current. Ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

$9.535

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 312 parts In-Stock

1+ parts

$9.535

100+ parts

$7.773

1k+ parts

$5.182

10k+ parts

-

312

$9.535

$7.773

$5.182

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 116 parts In-Stock

1+ parts

$9.058

100+ parts

-

1k+ parts

-

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116

$9.058

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-

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Vyrian

USA . 3,734 parts In-Stock

1+ parts

-

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-

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-

10k+ parts

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3,734

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 92 parts In-Stock

1+ parts

$8.100

100+ parts

-

1k+ parts

-

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92

$8.100

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-

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Semicontronic

India . 87 parts In-Stock

1+ parts

$8.100

100+ parts

$7.898

1k+ parts

$7.857

10k+ parts

-

87

$8.100

$7.898

$7.857

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Corphita

USA . 2,505 parts In-Stock

1+ parts

$8.582

100+ parts

-

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-

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2,505

$8.582

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Corohmni

South Africa . 489 parts In-Stock

1+ parts

$9.535

100+ parts

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489

$9.535

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-

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Parana Technologies

USA . 187 parts In-Stock

1+ parts

$19.673

100+ parts

-

1k+ parts

$19.667

10k+ parts

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187

$19.673

-

$19.667

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AZTECH Wire

Italy . 1,055 parts In-Stock

1+ parts

$21.320

100+ parts

-

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1,055

$21.320

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DigiPath Technology Company

USA . 1,247 parts In-Stock

1+ parts

$21.663

100+ parts

$19.930

1k+ parts

-

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1,247

$21.663

$19.930

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ChromeModa Solutions

Germany . 6,770 parts In-Stock

1+ parts

$22.105

100+ parts

$18.126

1k+ parts

-

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6,770

$22.105

$18.126

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

1+ parts

$22.105

100+ parts

$21.000

1k+ parts

$19.894

10k+ parts

-

2,015

$22.105

$21.000

$19.894

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Microchip USA

USA . 2,726 parts In-Stock

1+ parts

$23.165

100+ parts

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2,726

$23.165

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Overview

Discover the power of seamless energy management with the O917A152TRGZTQ1 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures optimal performance and efficiency. Experience the value of advanced technology combined with user-friendly features, providing customers with unmatched benefits and advantages. Upgrade your power management system today with the innovative O917A152TRGZTQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable allows for easier and more efficient installation of the Power Management IC on a circuit board, saving time and space.

Nominal Supply Voltage (Vsup): 3.8 V

The 3.8V supply voltage is within a common range for electronic devices, making it compatible with a wide variety of applications.

No. of Terminals: 48

With 48 terminals, this Power Management IC can accommodate a significant number of connections, enabling it to handle complex power management tasks effectively.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures that the Power Management IC can perform reliably even in demanding industrial environments.

Minimum Output Voltage: 0.7 V

The low minimum output voltage of 0.7V allows for precise control and regulation of the power output, essential for sensitive electronic components.

Minimum Operating Temperature: -40 °C

The wide operating temperature range starting from -40°C ensures the Power Management IC can function effectively in extreme cold conditions.

Maximum Output Voltage: 3.3 V

The 3.3V maximum output voltage provides sufficient power for a variety of electronic devices and components, making the Power Management IC versatile.

Width (mm): 7 mm

With a compact width of 7mm, this Power Management IC can fit into tight spaces on a circuit board, optimizing the layout and design of the overall system.

Maximum Output Current: 7 A

The high maximum output current of 7A allows the Power Management IC to deliver sufficient power to multiple outputs simultaneously, ideal for power-hungry devices.

Technical Specifications

Power Management ICs O917A152TRGZTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Outputs:

10

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

7 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

2700 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

O917A152TRGZTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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