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O917A133TRGZRQ1

Texas Instruments

O917A133TRGZRQ1 by Texas Instruments

Texas Instruments O917A133TRGZRQ1 is a Power Management IC with 48 terminals, operating at -40 to 105°C. It offers a max output voltage of 3.3V and current of 7A, suitable for industrial applications requiring precise power supply management in compact spaces.

Median Price

$6.318

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,350 parts In-Stock

1+ parts

$7.945

100+ parts

$6.477

1k+ parts

$4.318

10k+ parts

-

9,350

$7.945

$6.477

$4.318

-

Rochester

USA . 7,725 parts In-Stock

1+ parts

-

100+ parts

$5.390

1k+ parts

$4.820

10k+ parts

$4.540

7,725

-

$5.390

$4.820

$4.540

DigiKey

USA . 7,725 parts In-Stock

1+ parts

-

100+ parts

$5.900

1k+ parts

-

10k+ parts

-

7,725

-

$5.900

-

-

Verical

USA . 6,425 parts In-Stock

1+ parts

-

100+ parts

$6.737

1k+ parts

$6.025

10k+ parts

$5.675

6,425

-

$6.737

$6.025

$5.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,957 parts In-Stock

1+ parts

$5.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,957

$5.700

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$5.760

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$5.760

-

-

-

Vyrian

USA . 8,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,104

-

-

-

-

DigiKey Marketplace

USA . 7,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,745

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,010 parts In-Stock

1+ parts

$5.100

100+ parts

-

1k+ parts

-

10k+ parts

-

8,010

$5.100

-

-

-

Corphita

USA . 2,172 parts In-Stock

1+ parts

$5.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,172

$5.400

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.760

100+ parts

-

1k+ parts

$5.472

10k+ parts

$5.357

500

$5.760

-

$5.472

$5.357

Parana Technologies

USA . 1,385 parts In-Stock

1+ parts

$13.726

100+ parts

-

1k+ parts

$14.217

10k+ parts

-

1,385

$13.726

-

$14.217

-

DigiPath Technology Company

USA . 1,102 parts In-Stock

1+ parts

$15.114

100+ parts

$13.904

1k+ parts

-

10k+ parts

-

1,102

$15.114

$13.904

-

-

ChromeModa Solutions

Germany . 3,477 parts In-Stock

1+ parts

$15.422

100+ parts

$12.646

1k+ parts

-

10k+ parts

-

3,477

$15.422

$12.646

-

-

IDEA Electronic Components Group

UK . 2,305 parts In-Stock

1+ parts

$15.422

100+ parts

$14.651

1k+ parts

$13.880

10k+ parts

-

2,305

$15.422

$14.651

$13.880

-

Overview

Experience the power of cutting-edge technology with the O917A133TRGZRQ1 by Texas Instruments, a leading manufacturer in the industry. This Power Management IC offers unmatched reliability and efficiency, making it perfect for various applications. With its compact design and advanced features, this product ensures optimal performance and precise power management. Trust Texas Instruments to deliver superior quality and innovation, providing you with the best value for your investment. Upgrade your systems with the O917A133TRGZRQ1 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 3.8 V

The nominal supply voltage of 3.8 V ensures compatibility with a wide range of electronic devices, making it versatile and suitable for various applications.

No. of Terminals: 48

With 48 terminals, this power management IC provides ample connectivity options, allowing for complex system configurations and enhanced functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style with a chip carrier, heat sink/slug, and very thin profile offers efficient heat dissipation and space-saving design, making it suitable for compact devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance even in harsh environments, making it a reliable choice for industrial applications.

Minimum Output Voltage: 0.7 V

The minimum output voltage of 0.7 V allows for precise power regulation, ensuring stable and efficient operation of the connected components.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables this power management IC to function effectively in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent corrosion resistance and conductivity, ensuring long-term reliability and performance.

Maximum Output Voltage: 3.3 V

The maximum output voltage of 3.3 V allows for powering a variety of components, making it suitable for a wide range of applications.

Terminal Position: QUAD

The quad terminal position offers easy connectivity and installation, allowing for quick and efficient integration into electronic systems.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm enables this power management IC to be used in compact devices with limited space, making it a versatile choice for smaller applications.

Width (mm): 7 mm

The compact width of 7 mm ensures that this power management IC can be easily integrated into space-constrained designs, making it suitable for compact electronic devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC provides comprehensive control and monitoring of power distribution, ensuring efficient and reliable operation of the connected devices.

Minimum Supply Voltage (Vsup): 3.135 V

The minimum supply voltage of 3.135 V ensures compatibility with a wide range of power sources, making it a versatile choice for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for safe and efficient soldering during the manufacturing process, ensuring reliable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and stable connections, making it suitable for high-temperature manufacturing processes.

Length: 7 mm

The compact length of 7 mm allows for easy integration into space-constrained designs, making it a versatile choice for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environments, making it ideal for industrial applications requiring rugged and durable components.

Maximum Switching Frequency: 2700 kHz

The high maximum switching frequency of 2700 kHz enables fast and efficient power management, ensuring smooth operation of the connected devices.

Maximum Output Current: 7 A

The high maximum output current of 7 A allows for powering a variety of components, making it suitable for applications with higher power requirements.

No. of Channels: 10

With 10 channels, this power management IC provides ample connectivity options, allowing for versatile system configurations and enhanced functionality.

Terminal Form: NO LEAD

The no-lead terminal form offers improved reliability and durability, ensuring long-term performance and stable connections.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact design and efficient connectivity, making it suitable for smaller electronic devices.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the level of protection against moisture, ensuring the reliability and longevity of the power management IC in various environments.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage of 5.25 V allows for compatibility with a wide range of power sources, making it a versatile choice for different applications.

No. of Outputs: 10

With 10 outputs, this power management IC provides ample power distribution options, allowing for versatile system configurations and enhanced functionality.

Adjustable Threshold: YES

The adjustable threshold feature allows for customizable power management settings, providing flexibility and control over the operation of the connected components.

Technical Specifications

Power Management ICs O917A133TRGZRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Outputs:

10

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

7 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

2700 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

O917A133TRGZRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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