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NSBMC096VF33

Texas Instruments

NSBMC096VF33 by Texas Instruments

NSBMC096VF33 by Texas Instruments is a Memory Controller with 29-bit Address Bus Width, 16M X 1 Memory Organization, and 4 Banks. It operates at temperatures from 0 to 70 °C and has a supply voltage range of 4.5V to 5.5V. Ideal for applications requiring DRAM memory control like I960CA and I960CF bus compatibility.

Median Price

$38.460

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 30 parts In-Stock

1+ parts

$38.460

100+ parts

$28.850

1k+ parts

$25.000

10k+ parts

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30

$38.460

$28.850

$25.000

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Vyrian

USA . 947 parts In-Stock

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Digiode

USA . 485 parts In-Stock

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485

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 125 parts In-Stock

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Anansix

USA . 88 parts In-Stock

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Holdelec - ElecDif-Pro

France . 54 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 43 parts In-Stock

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Q Components

USA . 10 parts In-Stock

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A2Z Electronics, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$5.410

100+ parts

-

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762

$5.410

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One Stop Electronics

USA . 993 parts In-Stock

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$10.000

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993

$10.000

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Parana Technologies

USA . 1,589 parts In-Stock

1+ parts

$66.086

100+ parts

$6,137.093

1k+ parts

$59.477

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1,589

$66.086

$6,137.093

$59.477

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Corohmni

South Africa . 2,950 parts In-Stock

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$66.161

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$66.161

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DigiPath Technology Company

USA . 1,879 parts In-Stock

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$72.769

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1,879

$72.769

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ChromeModa Solutions

Germany . 497 parts In-Stock

1+ parts

$74.254

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$60.888

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497

$74.254

$60.888

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IDEA Electronic Components Group

UK . 251 parts In-Stock

1+ parts

$74.254

100+ parts

$70.541

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$66.829

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251

$74.254

$70.541

$66.829

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Lixinc

USA . 11,411 parts In-Stock

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Corphita

USA . 4,110 parts In-Stock

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Perfect Parts

USA . 392 parts In-Stock

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Kepictronics

USA . 190 parts In-Stock

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RC Electronics

USA . 148 parts In-Stock

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Overview

Enhance your electronic designs with the NSBMC096VF33 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This memory controller offers seamless integration into various applications, providing superior performance and efficiency. With a wide supply voltage range and advanced technology, this product ensures optimal functionality while maximizing value for customers. Upgrade your projects with the NSBMC096VF33 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the memory controller, ensuring longevity and reliability.

Maximum Supply Voltage: 5.5 V

Allows compatibility with various systems and applications that operate within the specified voltage range, increasing versatility.

Address Bus Width: 29

A wider address bus width allows for efficient and fast data processing, enhancing the performance of the memory controller.

Power Supplies (V): 5

Stable power supply at 5V ensures consistent and reliable operation of the memory controller.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability for the connections, ensuring a secure and long-lasting setup.

Memory Organization: 16M X 1

16M x 1 memory organization allows for efficient storage and retrieval of data, improving the overall performance of the memory controller.

Bus Compatibility: I960CA; I960CF

Compatible with I960CA and I960CF bus systems, ensuring seamless integration into existing setups and ease of use.

Technical Specifications

Memory Controllers NSBMC096VF33 attributes and parameters. Explore more Memory Controllers devices from Texas Instruments

Specs

Address Bus Width:

29

Boundary Scan:

NO

Bus Compatibility:

I960CA; I960CF

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e0

Length:

24.13 mm

Low Power Mode:

NO

Memory Organization:

16M X 1

No. of Banks:

4

No. of Terminals:

132

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, GUARD RING

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.45 mm

Sub-Category:

Memory Controllers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

NSBMC096VF33 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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