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NE556J4

Texas Instruments

NE556J4 by Texas Instruments

NE556J4 by Texas Instruments is a dual terminal analog waveform generator with 14 terminals. It operates at temperatures from 0 to 70°C and requires power supplies of 5/15V. This ceramic package in-line style IC is ideal for commercial applications requiring bipolar technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,321 parts In-Stock

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6,321

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Digiode

USA . 2,751 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,246 parts In-Stock

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$3.500

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1,246

$3.500

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Ampacity Inc.

Singapore . 841 parts In-Stock

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$3.500

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841

$3.500

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Semicontronic

India . 962 parts In-Stock

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$4.500

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$4.388

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$4.365

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962

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 895 parts In-Stock

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$16.228

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895

$16.228

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Parana Technologies

USA . 331 parts In-Stock

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$16.596

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$16.866

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331

$16.596

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$16.866

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ChromeModa Solutions

Germany . 6,451 parts In-Stock

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$18.647

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$15.291

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6,451

$18.647

$15.291

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IDEA Electronic Components Group

UK . 1,871 parts In-Stock

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$18.647

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$17.715

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$16.782

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Corphita

USA . 1,389 parts In-Stock

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DigiPath Technology Company

USA . 510 parts In-Stock

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$16.812

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510

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$16.812

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Corohmni

South Africa . 392 parts In-Stock

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Overview

Unleash the power of precise analog waveform generation with the NE556J4 by Texas Instruments. Known for its unwavering commitment to quality, Texas Instruments brings you a product that is built to exceed expectations. Perfect for a wide range of applications in industries such as telecommunications, automotive, and medical devices, the NE556J4 offers unmatched value, benefits, and advantages to customers looking for reliable and efficient waveform generation solutions. Elevate your projects with the NE556J4 and experience the difference that quality manufacturing can make.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and stability, ensuring the product operates efficiently and reliably even at high temperatures.

Power Supplies (V): 5/15

Dual power supply options of 5V and 15V allow for flexibility in different operating scenarios, making this product versatile in various applications.

No. of Terminals: 14

Having 14 terminals enables easy connection and integration with other components, making the product user-friendly and simplifying the setup process.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards and compact designs, optimizing space utilization in electronic systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand elevated temperatures without compromising performance, suitable for demanding environments.

Technology: BIPOLAR

Bipolar technology ensures accurate and stable waveform generation, making this product suitable for precision applications where precise analog signals are required.

Technical Specifications

Analog Waveform Generation NE556J4 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

NE556J4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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