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LP8900TLX-AAEB

Texas Instruments

LP8900TLX-AAEB by Texas Instruments

Texas Instruments LP8900TLX-AAEB is a fixed positive multiple output LDO regulator with 2 outputs. It has a max dropout voltage of 0.164 V and operates in temperatures ranging from -40 to 125°C. Ideal for applications requiring precise voltage regulation in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,476 parts In-Stock

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4,476

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Digiode

USA . 2,668 parts In-Stock

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2,668

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Anansix

USA . 2,145 parts In-Stock

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2,145

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Distributors (Availability)

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Parana Technologies

USA . 809 parts In-Stock

1+ parts

$8.559

100+ parts

-

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$9.219

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809

$8.559

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$9.219

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DigiPath Technology Company

USA . 223 parts In-Stock

1+ parts

$9.425

100+ parts

$8.671

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-

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223

$9.425

$8.671

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ChromeModa Solutions

Germany . 1,109 parts In-Stock

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$9.617

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$7.886

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1,109

$9.617

$7.886

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IDEA Electronic Components Group

UK . 784 parts In-Stock

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$9.617

100+ parts

$9.136

1k+ parts

$8.655

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784

$9.617

$9.136

$8.655

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One Stop Electronics

USA . 1,102 parts In-Stock

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$14.500

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1,102

$14.500

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AZTECH Wire

Italy . 502 parts In-Stock

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$15.229

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502

$15.229

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Ampacity Inc.

Singapore . 769 parts In-Stock

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$19.500

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769

$19.500

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,260 parts In-Stock

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Corphita

USA . 413 parts In-Stock

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413

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Overview

Experience the unparalleled quality of Texas Instruments with the LP8900TLX-AAEB, a fixed positive multiple output LDO regulator that offers exceptional performance and reliability. Perfect for a wide range of applications, this product provides stable power regulation while maintaining a low dropout voltage. With a compact design and advanced technology, customers can trust in the value and benefits that this versatile regulator brings to their projects. Trust in Texas Instruments to deliver top-notch solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Maximum Dropout Voltage-1: 0.164 V

Low dropout voltage ensures efficient power regulation, minimizing power loss and improving overall system efficiency.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the PCB, making it suitable for compact designs.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows the regulator to function reliably in various environmental conditions.

Nominal Output Voltage-2: 2.7 V

Stable output voltage helps ensure consistent performance of connected components, reducing the risk of damage due to voltage fluctuations.

No. of Outputs: 2

Having multiple outputs allows for powering different components or subsystems with one regulator, simplifying the design and reducing component count.

Maximum Output Current-1: 0.2 A

The high maximum output current rating makes this regulator suitable for powering a variety of components or devices with different power requirements.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP8900TLX-AAEB attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.164 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3.3 V

JESD-30 Code:

R-PBGA-B6

Length:

1.463 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Current-2:

.2 A

Maximum Output Voltage-1:

2.863 V

Minimum Output Voltage-1:

2.737 V

Nominal Output Voltage-1:

2.8 V

Maximum Output Voltage-2:

2.76 V

Minimum Output Voltage-2:

2.639 V

Nominal Output Voltage-2:

2.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification Status:

Not Qualified

Maximum Seated Height:

.675 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

Width:

1.057 mm

Trade Compliance

LP8900TLX-AAEB Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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