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LP8900TLX-AACB

Texas Instruments

LP8900TLX-AACB by Texas Instruments

LP8900TLX-AACB by Texas Instruments is a fixed positive multiple output LDO regulator with 2 outputs. It has a max dropout voltage of 0.26V and 0.164V, suitable for applications requiring precise voltage regulation in compact spaces. With a package style of grid array and very thin profile, it is ideal for surface mount designs where space is limited.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,411 parts In-Stock

1+ parts

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7,411

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Digiode

USA . 4,610 parts In-Stock

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4,610

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Anansix

USA . 2,815 parts In-Stock

1+ parts

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2,815

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 328 parts In-Stock

1+ parts

$7.088

100+ parts

-

1k+ parts

$7.616

10k+ parts

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328

$7.088

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$7.616

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DigiPath Technology Company

USA . 2,178 parts In-Stock

1+ parts

$7.805

100+ parts

$7.180

1k+ parts

-

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2,178

$7.805

$7.180

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IDEA Electronic Components Group

UK . 2,102 parts In-Stock

1+ parts

$7.964

100+ parts

-

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$7.168

10k+ parts

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2,102

$7.964

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$7.168

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ChromeModa Solutions

Germany . 1,197 parts In-Stock

1+ parts

$7.964

100+ parts

$6.530

1k+ parts

-

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1,197

$7.964

$6.530

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AZTECH Wire

Italy . 670 parts In-Stock

1+ parts

$10.520

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670

$10.520

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One Stop Electronics

USA . 804 parts In-Stock

1+ parts

$22.500

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804

$22.500

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Corphita

USA . 1,706 parts In-Stock

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1,706

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Overview

Discover the LP8900TLX-AACB by Texas Instruments, a top-quality fixed regulator with multiple output LDO. Manufactured by industry leader Texas Instruments, this product offers exceptional reliability and performance. Ideal for a variety of applications, this regulator provides stable power output with minimal dropout voltage. Experience the value and benefits of this product, ensuring your electronics run smoothly and efficiently. Trust Texas Instruments for superior quality components that deliver outstanding results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the regulator, ensuring long-term reliability.

Maximum Dropout Voltage-1: 0.164 V

Low dropout voltage ensures efficient power conversion and minimal energy loss.

Surface Mount: YES

Ease of installation and compatibility with modern circuit board designs.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range allows for use in various environments without compromising performance.

Nominal Output Voltage-2: 1.8 V

Stable and accurate output voltage for powering sensitive electronic components.

Terminal Form: BALL

Ball terminals provide secure connections and are suitable for automated assembly processes.

Minimum Output Voltage-1: 2.737 V

Consistent output voltage ensures reliable performance of connected devices.

No. of Terminals: 6

Sufficient number of terminals for flexible integration in a circuit design.

Maximum Seated Height: 0.675 mm

Low profile design for space-constrained applications.

Maximum Output Current-1: 0.2 A

Capable of delivering moderate current to power multiple components simultaneously.

Length: 1.463 mm

Compact size for easy integration in small electronic devices.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP8900TLX-AACB attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.164 V

Maximum Dropout Voltage-2:

.26 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3.3 V

JESD-30 Code:

R-PBGA-B6

Length:

1.463 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Current-2:

.2 A

Maximum Output Voltage-1:

2.863 V

Minimum Output Voltage-1:

2.737 V

Nominal Output Voltage-1:

2.8 V

Maximum Output Voltage-2:

1.8405 V

Minimum Output Voltage-2:

1.7595 V

Nominal Output Voltage-2:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification Status:

Not Qualified

Maximum Seated Height:

.675 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

Width:

1.057 mm

Trade Compliance

LP8900TLX-AACB Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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