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LP2966IMMX-2828

Texas Instruments

LP2966IMMX-2828 by Texas Instruments

LP2966IMMX-2828 by Texas Instruments is a Fixed Positive Multiple Output LDO Regulator with 2.8V nominal output voltage, 0.27V max dropout voltage, and 0.15A max output current per channel. It is ideal for applications requiring stable power supply in compact electronic devices due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,751 parts In-Stock

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Digiode

USA . 3,775 parts In-Stock

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Anansix

USA . 688 parts In-Stock

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688

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Parana Technologies

USA . 1,677 parts In-Stock

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$8.731

100+ parts

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$9.412

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1,677

$8.731

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$9.412

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ChromeModa Solutions

Germany . 3,253 parts In-Stock

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$9.810

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$8.044

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$9.810

$8.044

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IDEA Electronic Components Group

UK . 1,164 parts In-Stock

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$9.810

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$9.320

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$8.829

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$9.320

$8.829

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AZTECH Wire

Italy . 874 parts In-Stock

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$10.635

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One Stop Electronics

USA . 1,532 parts In-Stock

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$24.500

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Component Stockers USA

USA . 659 parts In-Stock

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$99.990

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 9,570 parts In-Stock

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Corphita

USA . 1,607 parts In-Stock

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Microchip USA

USA . 368 parts In-Stock

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DigiPath Technology Company

USA . 291 parts In-Stock

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$8.845

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$8.845

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Overview

Enhance your electronic designs with the LP2966IMMX-2828 from Texas Instruments, a leader in innovative solutions. This fixed positive multiple output LDO regulator boasts top-notch quality and reliability. Ideal for a range of applications, this regulator offers precise voltage control and efficient power management. Elevate your projects with the LP2966IMMX-2828 and experience the value, benefits, and advantages that it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

Maximum Dropout Voltage-1: 2.27 V

This low dropout voltage ensures efficient power conversion and minimal power loss.

Surface Mount: YES

Ease of installation and space-saving design.

Operating Temperature (TJ-Max): 125 °C

Wide temperature range for versatility in various applications.

Nominal Output Voltage-2: 2.8 V

Stable and precise output voltage for reliable performance.

Terminal Form: GULL WING

Easy soldering and secure connection.

Maximum Voltage Tolerance: 3 %

Accurate voltage regulation for consistent performance.

No. of Terminals: 8

Sufficient terminals for multiple connections.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

Ideal for applications requiring multiple regulated outputs.

Maximum Input Voltage: 7 V

Wide input voltage range for flexibility in power supply.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2966IMMX-2828 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.27 V

Maximum Dropout Voltage-2:

.27 V

Maximum Input Voltage:

7 V

Minimum Input Voltage:

2.7 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.884 V

Minimum Output Voltage-1:

2.716 V

Nominal Output Voltage-1:

2.8 V

Maximum Output Voltage-2:

2.884 V

Minimum Output Voltage-2:

2.716 V

Nominal Output Voltage-2:

2.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.09 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3 mm

Trade Compliance

LP2966IMMX-2828 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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