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LP2966IMM-2830

Texas Instruments

LP2966IMM-2830 by Texas Instruments

LP2966IMM-2830 by Texas Instruments is a fixed positive multiple output LDO regulator with 2 outputs. It has a max dropout voltage of 0.27 V, operating temperature range from -40 to 125°C, and a package style of small outline with gull wing terminals. Ideal for applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,994 parts In-Stock

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Anansix

USA . 2,439 parts In-Stock

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Digiode

USA . 1,216 parts In-Stock

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One Stop Electronics

USA . 1,186 parts In-Stock

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$2.500

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$2.500

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AZTECH Wire

Italy . 225 parts In-Stock

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$4.925

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$4.925

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Parana Technologies

USA . 1,818 parts In-Stock

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$5.257

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$5.879

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IDEA Electronic Components Group

UK . 1,232 parts In-Stock

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$5.907

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$5.316

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$5.907

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ChromeModa Solutions

Germany . 5 parts In-Stock

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$5.907

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$4.844

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$4.844

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Corphita

USA . 4,574 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,734 parts In-Stock

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Kepictronics

USA . 1,332 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,156 parts In-Stock

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DigiPath Technology Company

USA . 278 parts In-Stock

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$5.326

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Overview

Discover the LP2966IMM-2830 by Texas Instruments, a top-of-the-line Fixed Regulator with Positive Multiple Output LDO technology. With a commitment to quality and innovation, Texas Instruments delivers a superior product designed for a wide range of applications. This regulator offers customers unmatched value, reliability, and efficiency, making it the ideal choice for your electronic projects. Experience the advantages of Texas Instruments' LP2966IMM-2830 and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product sturdy yet easy to handle.

Maximum Dropout Voltage-2: 2.27 V

Low dropout voltage ensures efficient power regulation even when the input voltage is close to the output voltage.

Surface Mount: YES

Facilitates easy installation on PCBs, saving space and simplifying the manufacturing process.

Operating Temperature (TJ-Max): 125 °C

Allows the product to operate reliably in a wide range of temperatures, making it suitable for various environments.

Nominal Output Voltage-2: 3 V

Provides a stable output voltage of 3V, suitable for powering many electronic components.

Terminal Form: GULL WING

Gull wing terminals offer secure connections and ease of soldering during assembly.

Minimum Input Voltage: 2.7 V

Accepts a low input voltage, ensuring compatibility with various power sources.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP2966IMM-2830 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.27 V

Maximum Dropout Voltage-2:

.27 V

Maximum Input Voltage:

7 V

Minimum Input Voltage:

2.7 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.884 V

Minimum Output Voltage-1:

2.716 V

Nominal Output Voltage-1:

2.8 V

Maximum Output Voltage-2:

3.09 V

Minimum Output Voltage-2:

2.91 V

Nominal Output Voltage-2:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.09 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3 mm

Trade Compliance

LP2966IMM-2830 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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