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LP3986BLX3131

Texas Instruments

LP3986BLX3131 by Texas Instruments

LP3986BLX3131 by Texas Instruments is a fixed positive multiple output LDO regulator with 2 outputs. It has a max dropout voltage of 0.1 V and operates in temperatures ranging from -40 to 125°C. This regulator, housed in a square grid array package, is ideal for applications requiring precise voltage regulation in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,748 parts In-Stock

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4,748

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Digiode

USA . 2,868 parts In-Stock

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Anansix

USA . 360 parts In-Stock

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360

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Parana Technologies

USA . 1,802 parts In-Stock

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$6.804

100+ parts

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$7.450

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1,802

$6.804

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$7.450

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DigiPath Technology Company

USA . 817 parts In-Stock

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$7.492

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$6.893

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817

$7.492

$6.893

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ChromeModa Solutions

Germany . 3,814 parts In-Stock

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$7.645

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$6.269

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3,814

$7.645

$6.269

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IDEA Electronic Components Group

UK . 243 parts In-Stock

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$7.645

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$6.880

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243

$7.645

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$6.880

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AZTECH Wire

Italy . 656 parts In-Stock

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$11.853

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656

$11.853

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One Stop Electronics

USA . 643 parts In-Stock

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$18.500

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Corphita

USA . 3,032 parts In-Stock

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Kepictronics

USA . 1,006 parts In-Stock

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Overview

Discover the LP3986BLX3131 by Texas Instruments, a top-quality Fixed Regulator with Positive Multiple Output LDO technology. Manufactured by industry leader Texas Instruments, this product offers exceptional performance and reliability. Ideal for a wide range of applications, this regulator provides customers with superior value, efficiency, and precision. Trust Texas Instruments for all your power management needs and experience the benefits of cutting-edge technology at your fingertips. Unlock the potential of your projects with the LP3986BLX3131 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the regulator, ensuring a longer lifespan.

Maximum Dropout Voltage-2: 2.1 V

Allows for stable output voltage even when the input voltage drops significantly, ensuring consistent performance.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Operating Temperature (TJ-Max): 125 °C

Suitable for a wide range of operating environments, ensuring reliable operation even in challenging conditions.

Technology: CMOS

Provides efficient and reliable voltage regulation with low power consumption, ideal for a variety of applications.

Nominal Output Voltage-2: 3.1 V

Delivers a stable and accurate output voltage, ensuring consistent performance of connected devices.

Package Shape: SQUARE

Compact design that saves space on the circuit board, suitable for applications where size is a concern.

Maximum Output Voltage-1: 3.193 V

Provides a higher output voltage than the nominal value for added flexibility in powering components.

Width: 1.55 mm

Compact and slim design that allows for installation in tight spaces, suitable for compact electronic devices.

Maximum Input Voltage: 6 V

Supports a wide range of input voltages, making it versatile and compatible with various power sources.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP3986BLX3131 attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.1 V

Maximum Dropout Voltage-2:

.1 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.7 V

JESD-30 Code:

S-PBGA-B8

JESD-609 Code:

e0

Length:

1.55 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

3.193 V

Minimum Output Voltage-1:

3.007 V

Nominal Output Voltage-1:

3.1 V

Maximum Output Voltage-2:

3.193 V

Minimum Output Voltage-2:

3.007 V

Nominal Output Voltage-2:

3.1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification Status:

Not Qualified

Maximum Seated Height:

.995 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

3 %

Width:

1.55 mm

Trade Compliance

LP3986BLX3131 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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