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LP3986BLX-3131/NOPB

Texas Instruments

LP3986BLX-3131/NOPB by Texas Instruments

LP3986BLX-3131/NOPB by Texas Instruments is a fixed positive multiple output LDO regulator with 2 outputs. It has a max dropout voltage of 0.1 V, operating temperature range from -40 to 125°C, and a package style of grid array for applications requiring precise voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,685 parts In-Stock

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7,685

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Digiode

USA . 2,875 parts In-Stock

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2,875

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Anansix

USA . 756 parts In-Stock

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756

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One Stop Electronics

USA . 1,492 parts In-Stock

1+ parts

$7.500

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1,492

$7.500

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Parana Technologies

USA . 1,065 parts In-Stock

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$8.169

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$8.771

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1,065

$8.169

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$8.771

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DigiPath Technology Company

USA . 1,853 parts In-Stock

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$8.995

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$8.276

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1,853

$8.995

$8.276

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ChromeModa Solutions

Germany . 3,299 parts In-Stock

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$9.179

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$7.527

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3,299

$9.179

$7.527

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IDEA Electronic Components Group

UK . 914 parts In-Stock

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$9.179

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$8.720

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$8.261

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914

$9.179

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$8.261

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AZTECH Wire

Italy . 795 parts In-Stock

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$15.607

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795

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Corphita

USA . 4,629 parts In-Stock

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4,629

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Overview

Experience superior quality and reliability with the Texas Instruments LP3986BLX-3131/NOPB Fixed Regulator - Positive Multiple Output LDO. This innovative product boasts top-notch technology and a wide range of applications, making it an essential component for various electronic devices. With Texas Instruments' reputation for excellence, customers can trust in the value and benefits this regulator provides, ensuring optimal performance and efficiency. Upgrade your products with the LP3986BLX-3131/NOPB and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand rough handling during installation or operation.

Maximum Dropout Voltage-2: 2.1 V

The low maximum dropout voltage of 2.1V ensures efficient regulation of voltage, minimizing power loss in the system.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and facilitating automated assembly processes.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature of 125°C, the regulator can operate reliably in demanding environmental conditions without overheating.

Nominal Output Voltage-2: 3.1 V

The regulator provides a stable nominal output voltage of 3.1V, ensuring consistent performance of connected devices or components.

No. of Terminals: 8

The presence of 8 terminals allows for versatile connectivity options, accommodating multiple input and output configurations as needed.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

Being a fixed positive multiple output LDO regulator, this product offers reliable and precise voltage regulation for multiple outputs, making it suitable for various electronic applications.

Minimum Input Voltage: 2.7 V

The low minimum input voltage requirement of 2.7V enables the regulator to operate effectively even with low power input sources, expanding its compatibility with different systems.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP3986BLX-3131/NOPB attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.1 V

Maximum Dropout Voltage-2:

.1 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.7 V

JESD-30 Code:

S-PBGA-B8

Length:

1.55 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

3.193 V

Minimum Output Voltage-1:

3.007 V

Nominal Output Voltage-1:

3.1 V

Maximum Output Voltage-2:

3.193 V

Minimum Output Voltage-2:

3.007 V

Nominal Output Voltage-2:

3.1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification Status:

Not Qualified

Maximum Seated Height:

.995 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

3 %

Width:

1.55 mm

Trade Compliance

LP3986BLX-3131/NOPB Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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