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NCP156AAFCT110280T2G

Onsemi

NCP156AAFCT110280T2G by Onsemi

NCP156AAFCT110280T2G by Onsemi is a Fixed Positive Multiple Output LDO Regulator with 2 outputs. It has a Max Dropout Voltage of 0.16V and 0.15V, suitable for applications requiring precise voltage regulation in compact spaces. The package style is Grid Array, making it ideal for surface mount applications where space is limited.

Median Price

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Lifecycle Status

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Problanco Electronics

Mexico . 4,485 parts In-Stock

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TANS Electronics

Latvia . 3,827 parts In-Stock

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Kulean Microsystems

USA . 1,621 parts In-Stock

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Corphita

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Corohmni

South Africa . 474 parts In-Stock

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Overview

When it comes to reliable power management solutions, look no further than the NCP156AAFCT110280T2G by Onsemi. This fixed regulator offers a multitude of benefits, from high-quality manufacturing to versatile applications in positive multiple output LDO systems. With Onsemi's reputation for excellence and precision engineering, customers can trust in the value and performance that this product provides. Whether you're in need of efficient power distribution or stable voltage regulation, the NCP156AAFCT110280T2G delivers on all fronts, making it an essential component for any electronics project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the regulator lightweight, durable, and cost-effective.

Maximum Dropout Voltage-2: 2.16 V

The low maximum dropout voltage ensures efficient performance and minimal power loss in the output circuit.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on a PCB, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

The wide operating temperature range makes this regulator suitable for various environmental conditions and applications.

Minimum Output Voltage-2: 2.744 V

The stable minimum output voltage ensures a reliable power supply for connected components.

Nominal Output Voltage-2: 2.8 V

The consistent nominal output voltage provides a reliable and stable power source for the connected components.

Adjustability: FIXED

The fixed output voltage eliminates the need for adjustment, making the regulator easy to use and reliable in operation.

Nominal Dropout Voltage-1: 0.07 V

The low nominal dropout voltage ensures efficient power conversion and minimal energy loss during operation.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO NCP156AAFCT110280T2G attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.15 V

Nominal Dropout Voltage-1:

.07 V

Maximum Dropout Voltage-2:

.16 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.4 V

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e3

Length:

1.2 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Current-2:

.25 A

Maximum Output Voltage-1:

1.1198 V

Minimum Output Voltage-1:

1.0802 V

Nominal Output Voltage-1:

1.1 V

Maximum Output Voltage-2:

2.856 V

Minimum Output Voltage-2:

2.744 V

Nominal Output Voltage-2:

2.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,16

Package Shape:

RECTANGULAR

Package Style (Meter):

GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

Packing Method:

TR

Maximum Seated Height:

.33 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

2 %

Width:

.8 mm

Trade Compliance

NCP156AAFCT110280T2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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