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NCP152MX180180TCG

Onsemi

NCP152MX180180TCG by Onsemi

NCP152MX180180TCG by Onsemi is a Fixed Positive Multiple Output LDO Regulator with 1.8V nominal output voltage, 0.4V max dropout voltage, and 0.15A max output current per channel. It is ideal for applications requiring stable power supply in compact spaces, such as IoT devices and portable electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,103 parts In-Stock

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Digiode

USA . 411 parts In-Stock

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TANS Electronics

Latvia . 6,994 parts In-Stock

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Kulean Microsystems

USA . 1,691 parts In-Stock

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Corphita

USA . 1,433 parts In-Stock

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Problanco Electronics

Mexico . 1,031 parts In-Stock

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SupplyDigital Components

Austria . 585 parts In-Stock

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UHIMA Technologies

Türkiye . 306 parts In-Stock

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Corohmni

South Africa . 203 parts In-Stock

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Overview

Discover the NCP152MX180180TCG by Onsemi, a top-tier manufacturer known for delivering high-quality Fixed Regulators - Positive Multiple Output LDO. This cutting-edge product offers stability and reliability for various applications. With its advanced technology and precise output voltage control, customers can trust in its performance. Experience the value and benefits of this regulator, providing efficiency and peace of mind for your projects. Upgrade to Onsemi for superior quality and dependability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the regulator, making it suitable for various applications and environments.

Maximum Dropout Voltage-2: 2.4 V

The low dropout voltage ensures efficient regulation of the output voltage even when the input voltage is close to the desired output voltage, improving overall performance.

Surface Mount: YES

Being surface mountable makes installation and integration easier, saving space and making it suitable for compact designs.

Operating Temperature (TJ-Max): 85 °C

With a high operating temperature range, this regulator can function reliably in a wide range of environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the regulator energy-efficient and reliable.

Nominal Output Voltage-2: 1.8 V

The stable output voltage ensures consistent performance of connected components, making it a reliable choice for powering multiple devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process and reduces potential points of failure, ensuring a secure and long-lasting connection.

Maximum Voltage Tolerance: 3.3 %

The tight voltage tolerance ensures precise regulation of the output voltage, making it suitable for applications where consistent power supply is crucial.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

As a fixed positive multiple output regulator with low dropout voltage, this product can efficiently and reliably power multiple components in a circuit.

Maximum Output Current-1: 0.15 A

The high output current rating allows the regulator to supply sufficient power to connected devices, making it versatile for various applications.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO NCP152MX180180TCG attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.4 V

Nominal Dropout Voltage-1:

.37 V

Maximum Dropout Voltage-2:

.4 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1.2 mm

Maximum Load Regulation:

.05 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

6

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

1.86 V

Minimum Output Voltage-1:

1.74 V

Nominal Output Voltage-1:

1.8 V

Maximum Output Voltage-2:

1.86 V

Minimum Output Voltage-2:

1.74 V

Nominal Output Voltage-2:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.05,16

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.45 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

1.2 mm

Trade Compliance

NCP152MX180180TCG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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