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LP8556TMX-E09/NOPB

Texas Instruments

LP8556TMX-E09/NOPB by Texas Instruments

LP8556TMX-E09/NOPB by Texas Instruments is a graphics display driver with 6 channels and 12 segments. It operates b/w -30 to 85 °C, with a supply voltage range of 2.7V to 20V. Ideal for LED displays, it features a serial data input mode and terminal finish of Tin Silver Copper.

Median Price

$1.160

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 86,350 parts In-Stock

1+ parts

$1.160

100+ parts

$0.958

1k+ parts

$0.518

10k+ parts

-

86,350

$1.160

$0.958

$0.518

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 213 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

-

10k+ parts

-

213

$1.102

-

-

-

Chip Stock

USA . 19,010 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,010

-

-

-

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Vyrian

USA . 3,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,569

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 888 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

888

$1.044

-

-

-

Parana Technologies

USA . 684 parts In-Stock

1+ parts

$9.184

100+ parts

-

1k+ parts

$9.827

10k+ parts

-

684

$9.184

-

$9.827

-

IDEA Electronic Components Group

UK . 618 parts In-Stock

1+ parts

$10.319

100+ parts

$9.803

1k+ parts

$9.287

10k+ parts

-

618

$10.319

$9.803

$9.287

-

ChromeModa Solutions

Germany . 113 parts In-Stock

1+ parts

$10.319

100+ parts

$8.462

1k+ parts

-

10k+ parts

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113

$10.319

$8.462

-

-

AZTECH Wire

Italy . 909 parts In-Stock

1+ parts

$10.810

100+ parts

-

1k+ parts

-

10k+ parts

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909

$10.810

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-

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Lixinc

USA . 19,988 parts In-Stock

1+ parts

-

100+ parts

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19,988

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

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Kepictronics

USA . 2,800 parts In-Stock

1+ parts

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100+ parts

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2,800

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,800

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-

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,200

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-

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DigiPath Technology Company

USA . 78 parts In-Stock

1+ parts

-

100+ parts

$9.304

1k+ parts

-

10k+ parts

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78

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$9.304

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Overview

Elevate your display experience with the LP8556TMX-E09/NOPB by Texas Instruments. As a leader in graphics display drivers, Texas Instruments delivers top-notch quality and reliability. This product is perfect for applications requiring a serial data input mode and offers a wide operating temperature range. With its compact size and efficient power supplies, the LP8556TMX-E09/NOPB provides exceptional value and performance. Upgrade your next project with this versatile LED display driver and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making the product long-lasting and reliable.

Data Input Mode: SERIAL

Serial data input allows for efficient and quick communication between devices, making this product suitable for high-speed data transfer requirements.

Surface Mount: YES

The surface mount feature allows for easy integration and space-saving design, making it ideal for compact applications.

Maximum Supply Voltage: 20 V

With a high maximum supply voltage, this product can handle varying power requirements and ensure stable performance.

No. of Terminals: 20

Having a sufficient number of terminals enables versatile connectivity options and allows for interfacing with multiple devices.

Minimum Operating Temperature: -30 °C

The wide operating temperature range ensures reliable performance even in extreme cold conditions, making this product suitable for various environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Width: 1.71 mm

The compact width of the product allows for space-efficient design and easy integration into various applications.

No. of Channels: 6

Having multiple channels enables the product to drive multiple segments or display elements independently, providing flexibility in displaying information.

Nominal Supply Voltage: 12 V

The nominal supply voltage matches standard power requirements, ensuring compatibility with common power sources.

Technical Specifications

Graphics Display Drivers LP8556TMX-E09/NOPB attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

2.371 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Channels:

6

No. of Functions:

1

No. of Segments:

12

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.71 mm

Trade Compliance

LP8556TMX-E09/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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