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LP8556TMX-E07/NOPB

Texas Instruments

LP8556TMX-E07/NOPB by Texas Instruments

LP8556TMX-E07/NOPB by Texas Instruments is a graphics display driver with 12 segments. It operates b/w -30 to 85 °C and has a supply voltage range of 1.62V to 3.6V. Ideal for LED displays, it features a serial data input mode and comes in a compact rectangular package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,534 parts In-Stock

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7,534

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Digiode

USA . 2,491 parts In-Stock

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2,491

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Distributors (Availability)

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AZTECH Wire

Italy . 848 parts In-Stock

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$8.004

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848

$8.004

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Parana Technologies

USA . 1,201 parts In-Stock

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$12.172

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$12.584

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$12.172

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$12.584

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DigiPath Technology Company

USA . 287 parts In-Stock

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$13.402

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$12.330

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287

$13.402

$12.330

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ChromeModa Solutions

Germany . 2,754 parts In-Stock

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$13.676

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$11.214

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$13.676

$11.214

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IDEA Electronic Components Group

UK . 1,397 parts In-Stock

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$13.676

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$12.992

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$12.308

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1,397

$13.676

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$12.308

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One Stop Electronics

USA . 214 parts In-Stock

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$18.500

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214

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Component Stockers USA

USA . 623 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Microchip USA

USA . 2,318 parts In-Stock

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Lixinc

USA . 2,228 parts In-Stock

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Corphita

USA . 810 parts In-Stock

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Overview

Enhance your graphics display with the LP8556TMX-E07/NOPB by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This LED display driver offers seamless data input via serial mode, making it easy to integrate into various applications. Its compact design and fine pitch package style provide a space-saving solution without compromising performance. Elevate your projects with this reliable and efficient component, designed to meet the demands of modern technology. Experience the value and benefits this product brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it a reliable choice for various applications.

Data Input Mode: SERIAL

The serial data input mode allows for easy and efficient data transmission, making the product suitable for fast-paced operations.

Surface Mount: YES

Being surface mountable makes the installation of the product convenient and saves space on the PCB, ideal for compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage tolerance provides flexibility in power supply options and ensures reliable performance in different voltage environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs, making it compatible with standard PCB layouts.

No. of Terminals: 20

Having a higher number of terminals enables greater connectivity options and functionality, making the product versatile in usage.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish provides excellent conductivity and reliability, ensuring stable connections for optimal performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the product to function efficiently in various environmental conditions without overheating.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature range ensures the product can operate reliably even in cold environments, making it suitable for diverse applications.

Width: 1.715 mm

The compact width of the product saves space on the PCB, enabling efficient design layouts in constrained spaces.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V provides optimal power requirements for the product, improving energy efficiency and reducing power consumption.

No. of Segments: 12

The inclusion of 12 segments offers versatility in display options, allowing for customizable and dynamic visual outputs.

Technical Specifications

Graphics Display Drivers LP8556TMX-E07/NOPB attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

2.376 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Segments:

12

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.715 mm

Trade Compliance

LP8556TMX-E07/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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