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LP8556TME-E02/NOPB

Texas Instruments

LP8556TME-E02/NOPB by Texas Instruments

LP8556TME-E02/NOPB by Texas Instruments is a Graphics Display Driver with 12V power supply, 6 channels, and 12 segments. It operates b/w -30 to 85°C, has a serial data input mode, and uses a grid array package style. Ideal for LED display driver applications requiring thin profile components.

Median Price

$2.190

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 47,081 parts In-Stock

1+ parts

$1.566

100+ parts

$1.293

1k+ parts

$0.699

10k+ parts

-

47,081

$1.566

$1.293

$0.699

-

DigiKey

USA . 560 parts In-Stock

1+ parts

$2.190

100+ parts

$1.319

1k+ parts

-

10k+ parts

-

560

$2.190

$1.319

-

-

Mouser Electronics

USA . 308 parts In-Stock

1+ parts

$2.190

100+ parts

$1.320

1k+ parts

$1.130

10k+ parts

$1.100

308

$2.190

$1.320

$1.130

$1.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,925 parts In-Stock

1+ parts

$1.488

100+ parts

-

1k+ parts

-

10k+ parts

-

4,925

$1.488

-

-

-

Vyrian

USA . 6,108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,108

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,978 parts In-Stock

1+ parts

$1.409

100+ parts

-

1k+ parts

-

10k+ parts

-

4,978

$1.409

-

-

-

Parana Technologies

USA . 614 parts In-Stock

1+ parts

$4.540

100+ parts

-

1k+ parts

$4.986

10k+ parts

-

614

$4.540

-

$4.986

-

DigiPath Technology Company

USA . 453 parts In-Stock

1+ parts

$4.999

100+ parts

-

1k+ parts

-

10k+ parts

-

453

$4.999

-

-

-

ChromeModa Solutions

Germany . 3,949 parts In-Stock

1+ parts

$5.101

100+ parts

$4.183

1k+ parts

-

10k+ parts

-

3,949

$5.101

$4.183

-

-

IDEA Electronic Components Group

UK . 574 parts In-Stock

1+ parts

$5.101

100+ parts

-

1k+ parts

$4.591

10k+ parts

-

574

$5.101

-

$4.591

-

Microchip USA

USA . 2,546 parts In-Stock

1+ parts

$9.178

100+ parts

-

1k+ parts

-

10k+ parts

-

2,546

$9.178

-

-

-

Lixinc

USA . 13,265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,265

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,015

-

-

-

-

Alle Elektronik GmbH

Germany . 4,010 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,010

-

-

-

-

Authorized Procurement Solutions

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

-

-

-

-

Overview

Elevate your display experience with the LP8556TME-E02/NOPB by Texas Instruments, a top-quality Graphics Display Driver that sets the standard in the industry. Designed for maximum performance and reliability, this product is perfect for a wide range of applications. With Texas Instruments' reputation for excellence and innovation, you can trust that this product delivers unmatched value and benefits to customers. Upgrade your displays with ease and confidence, thanks to the LP8556TME-E02/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and longevity.

Data Input Mode: SERIAL

Efficient and reliable data transfer for seamless operation.

Surface Mount: YES

Easy installation on circuit boards for space-saving design.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages for enhanced performance.

Package Shape: RECTANGULAR

Sleek and compact design for versatile mounting options.

Power Supplies (V): 12

Supports multiple power supplies for flexibility in usage.

Minimum Supply Voltage: 1.62 V

Operates efficiently even at low supply voltages for energy savings.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures for reliable performance in various environments.

Minimum Operating Temperature: -30 °C

Operates in extreme cold conditions without any issue.

Terminal Finish: TIN SILVER COPPER

High-quality finish for improved conductivity and longevity.

Terminal Position: BOTTOM

Convenient terminal placement for easy connectivity.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Advanced package style for compact design and efficient performance.

Maximum Seated Height: 0.675 mm

Low profile for space-saving installation.

Width: 1.715 mm

Slim width for versatile placement options on PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for efficient soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering process.

Length: 2.376 mm

Compact length for space-efficient board layout.

No. of Channels: 6

Multiple channels for driving various display segments.

Terminal Form: BALL

Spherical terminal form for secure and reliable connections.

Input Characteristics: STANDARD

Standard input characteristics for easy integration with existing systems.

Nominal Supply Voltage: 1.8 V

Optimal supply voltage for efficient performance.

No. of Segments: 12

Supports multiple display segments for versatile applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch for compact design and efficient connections.

Interface IC Type: LED DISPLAY DRIVER

Specific interface IC type for driving LED displays with accuracy and precision.

Technical Specifications

Graphics Display Drivers LP8556TME-E02/NOPB attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PBGA-B20

JESD-609 Code:

e1

Length:

2.376 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Channels:

6

No. of Functions:

1

No. of Segments:

12

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA20,4X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.715 mm

Trade Compliance

LP8556TME-E02/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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