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LMP92064SD/NOPB

Texas Instruments

LMP92064SD/NOPB by Texas Instruments

LMP92064SD/NOPB by Texas Instruments is a Power Management IC with 16 terminals, operating at -40 to 105°C. It supports a supply voltage range of 4.5-5.5V and has a small outline package suitable for industrial applications requiring precise power supply support circuits.

Median Price

$8.260

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,402 parts In-Stock

1+ parts

$10.132

100+ parts

$8.878

1k+ parts

$5.016

10k+ parts

-

25,402

$10.132

$8.878

$5.016

-

Mouser Electronics

USA . 173 parts In-Stock

1+ parts

$12.870

100+ parts

$8.260

1k+ parts

$6.850

10k+ parts

-

173

$12.870

$8.260

$6.850

-

Rochester

USA . 825 parts In-Stock

1+ parts

-

100+ parts

$6.280

1k+ parts

$5.620

10k+ parts

$5.290

825

-

$6.280

$5.620

$5.290

DigiKey

USA . 825 parts In-Stock

1+ parts

-

100+ parts

$8.260

1k+ parts

-

10k+ parts

-

825

-

$8.260

-

-

Verical

USA . 825 parts In-Stock

1+ parts

-

100+ parts

$7.850

1k+ parts

$7.025

10k+ parts

$6.612

825

-

$7.850

$7.025

$6.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.546

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$6.546

-

-

-

Digiode

USA . 89 parts In-Stock

1+ parts

$6.622

100+ parts

-

1k+ parts

-

10k+ parts

-

89

$6.622

-

-

-

Vyrian

USA . 6,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,559

-

-

-

-

DigiKey Marketplace

USA . 825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

825

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 945 parts In-Stock

1+ parts

$2.950

100+ parts

-

1k+ parts

-

10k+ parts

-

945

$2.950

-

-

-

Ampacity Inc.

Singapore . 6,715 parts In-Stock

1+ parts

$5.920

100+ parts

-

1k+ parts

-

10k+ parts

-

6,715

$5.920

-

-

-

Parana Technologies

USA . 1,685 parts In-Stock

1+ parts

$5.972

100+ parts

-

1k+ parts

$6.750

10k+ parts

-

1,685

$5.972

-

$6.750

-

Corphita

USA . 2,091 parts In-Stock

1+ parts

$6.273

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

$6.273

-

-

-

DigiPath Technology Company

USA . 2,120 parts In-Stock

1+ parts

$6.576

100+ parts

$6.050

1k+ parts

-

10k+ parts

-

2,120

$6.576

$6.050

-

-

ChromeModa Solutions

Germany . 3,374 parts In-Stock

1+ parts

$6.710

100+ parts

$5.502

1k+ parts

-

10k+ parts

-

3,374

$6.710

$5.502

-

-

IDEA Electronic Components Group

UK . 1,757 parts In-Stock

1+ parts

$6.710

100+ parts

-

1k+ parts

$6.039

10k+ parts

-

1,757

$6.710

-

$6.039

-

Microchip USA

USA . 1,294 parts In-Stock

1+ parts

$18.870

100+ parts

$18.600

1k+ parts

$18.460

10k+ parts

$18.330

1,294

$18.870

$18.600

$18.460

$18.330

QUARKTWIN TECHNOLOGY LTD

USA . 28,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,803

-

-

-

-

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Experience superior power management with the LMP92064SD/NOPB by Texas Instruments. As a global leader in semiconductor manufacturing, Texas Instruments delivers unparalleled quality and reliability. This power management IC is perfect for a wide range of applications, offering customers exceptional value and benefits. Trust in Texas Instruments to provide cutting-edge technology that meets your needs with precision and efficiency. Elevate your projects with the LMP92064SD/NOPB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and facilitating automated assembly.

Nominal Supply Voltage (Vsup): 5 V

Compatible with a wide range of applications that require a 5V power supply.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial environments with demanding operating conditions.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance for reliable electrical connections.

Moisture Sensitivity Level (MSL): 3

Indicates that the IC has moderate sensitivity to moisture, suitable for most applications in controlled environments.

Technical Specifications

Power Management ICs LMP92064SD/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

LMP92064SD/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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