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LMP92018SQX/NOPB

Texas Instruments

LMP92018SQX/NOPB by Texas Instruments

LMP92018SQX/NOPB by Texas Instruments is a Power Management IC with 12 channels and a supply voltage range of 4.75V to 5.25V. It features a square package shape, operates in automotive temperature grade (-40°C to 125°C), and has a low max seated height of 0.8mm. Ideal for power supply support circuits in compact applications.

Median Price

$7.489

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,771 parts In-Stock

1+ parts

$7.489

100+ parts

$6.105

1k+ parts

$4.070

10k+ parts

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27,771

$7.489

$6.105

$4.070

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 646 parts In-Stock

1+ parts

$7.115

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646

$7.115

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Chip Stock

USA . 28,030 parts In-Stock

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28,030

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Vyrian

USA . 5,957 parts In-Stock

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TME

Poland . 2,500 parts In-Stock

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$7.155

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$7.155

Sensible Micro Corp

USA . 827 parts In-Stock

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827

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Distributors (Availability)

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Parana Technologies

USA . 1,354 parts In-Stock

1+ parts

$5.136

100+ parts

-

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$5.728

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1,354

$5.136

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$5.728

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DigiPath Technology Company

USA . 740 parts In-Stock

1+ parts

$5.656

100+ parts

$5.203

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740

$5.656

$5.203

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ChromeModa Solutions

Germany . 4,798 parts In-Stock

1+ parts

$5.771

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$4.732

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4,798

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$4.732

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IDEA Electronic Components Group

UK . 721 parts In-Stock

1+ parts

$5.771

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$5.194

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721

$5.771

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$5.194

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Semicontronic

India . 27,343 parts In-Stock

1+ parts

$6.370

100+ parts

$6.211

1k+ parts

$6.179

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27,343

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$6.179

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Ampacity Inc.

Singapore . 27,314 parts In-Stock

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Corphita

USA . 3,217 parts In-Stock

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$6.740

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$6.740

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Corohmni

South Africa . 420 parts In-Stock

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$7.489

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AZTECH Wire

Italy . 989 parts In-Stock

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$15.910

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989

$15.910

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A-Z Elektronik GmbH

Germany . 4,550 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,033 parts In-Stock

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Overview

Elevate your power management solutions with the LMP92018SQX/NOPB by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers a cutting-edge Power Management IC that is perfect for a wide range of applications. With a sleek square package shape and multiple terminals, this IC offers seamless integration and precise performance. Whether you're in the automotive industry or looking to upgrade your power supply support circuit, the LMP92018SQX/NOPB provides unmatched value, efficiency, and flexibility. Trust Texas Instruments to power up your devices with excellence.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient installation on PCBs, saving time and effort in assembly processes.

Nominal Supply Voltage (Vsup): 5 V

Stable and common supply voltage ensures compatibility with various systems and devices.

No. of Channels: 12

Having multiple channels allows for versatile and flexible power management capabilities, suitable for complex systems.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements, making it ideal for automotive applications where temperature fluctuations are common.

Adjustable Threshold: YES

Allows for customization and fine-tuning of thresholds, providing flexibility in power management settings.

Technical Specifications

Power Management ICs LMP92018SQX/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

LMP92018SQX/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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