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LMP92018CISQX

Texas Instruments

LMP92018CISQX by Texas Instruments

LMP92018CISQX by Texas Instruments is a Power Management IC with 8 channels, adjustable threshold, and 5V nominal voltage. It is designed for automotive applications, featuring a square package shape and operating temperature range of -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,542 parts In-Stock

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Digiode

USA . 3,294 parts In-Stock

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3,294

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One Stop Electronics

USA . 1,365 parts In-Stock

1+ parts

$1.500

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$1.500

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Ampacity Inc.

Singapore . 1,048 parts In-Stock

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$2.500

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1,048

$2.500

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Semicontronic

India . 477 parts In-Stock

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$6.500

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$6.338

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$6.305

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477

$6.500

$6.338

$6.305

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Parana Technologies

USA . 1,563 parts In-Stock

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$7.140

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$7.653

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1,563

$7.140

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$7.653

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DigiPath Technology Company

USA . 540 parts In-Stock

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$7.863

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540

$7.863

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ChromeModa Solutions

Germany . 1,338 parts In-Stock

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$8.023

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$6.579

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$8.023

$6.579

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IDEA Electronic Components Group

UK . 624 parts In-Stock

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$8.023

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$7.221

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AZTECH Wire

Italy . 539 parts In-Stock

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$18.228

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Corphita

USA . 2,083 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Overview

Enhance your power management solutions with the Texas Instruments LMP92018CISQX, a high-quality Power Management IC designed for automotive applications. Manufactured by industry leader Texas Instruments, this square-shaped chip carrier offers 8 channels and a nominal supply voltage of 5V, ensuring reliable performance in a compact package. With a temperature range of -40 to 125°C, adjustable threshold, and no-lead terminal form, this innovative IC provides value and efficiency for your power supply support circuit needs. Experience the benefits of superior quality and performance with the LMP92018CISQX from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and labor costs.

Nominal Supply Voltage (Vsup): 5 V

The consistent supply voltage of 5V ensures stable performance and reliable operation of the power management IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style options provide flexibility for different mounting and cooling requirements, making it versatile for various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance even in harsh environments or under heavy loads.

Terminal Pitch: 0.5 mm

The small terminal pitch enables a compact design and space-saving layout on the PCB, making it ideal for applications with limited space.

Technical Specifications

Power Management ICs LMP92018CISQX attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

6 mm

Trade Compliance

LMP92018CISQX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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