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LMK04816BISQ/NOPB

Texas Instruments

LMK04816BISQ/NOPB by Texas Instruments

LMK04816BISQ/NOPB clock driver by Texas Instruments operates at 3.3V, with 64 terminals and a load capacitance of 5pF. It features differential mux input conditioning, a max fmax of 2600MHz, and industrial temperature grade suitability. Ideal for applications requiring precise clock synchronization in electronic systems.

Median Price

$12.810

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,637 parts In-Stock

1+ parts

$12.810

100+ parts

$11.190

1k+ parts

$7.717

10k+ parts

-

13,637

$12.810

$11.190

$7.717

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,044 parts In-Stock

1+ parts

$12.170

100+ parts

-

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1,044

$12.170

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Vyrian

USA . 2,020 parts In-Stock

1+ parts

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2,020

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 545 parts In-Stock

1+ parts

$6.935

100+ parts

-

1k+ parts

$6.658

10k+ parts

$6.658

545

$6.935

-

$6.658

$6.658

Corphita

USA . 145 parts In-Stock

1+ parts

$11.529

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-

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145

$11.529

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AZTECH Wire

Italy . 361 parts In-Stock

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$14.800

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361

$14.800

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Parana Technologies

USA . 1,263 parts In-Stock

1+ parts

$15.755

100+ parts

$1,463.070

1k+ parts

$14.179

10k+ parts

-

1,263

$15.755

$1,463.070

$14.179

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DigiPath Technology Company

USA . 1,200 parts In-Stock

1+ parts

$17.348

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1,200

$17.348

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IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$17.702

100+ parts

$16.817

1k+ parts

$15.932

10k+ parts

-

1,599

$17.702

$16.817

$15.932

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ChromeModa Solutions

Germany . 1,310 parts In-Stock

1+ parts

$17.702

100+ parts

$14.516

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1,310

$17.702

$14.516

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Lixinc

USA . 13,556 parts In-Stock

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13,556

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Overview

Discover the innovative LMK04816BISQ/NOPB clock driver & buffer by Texas Instruments, designed for precision and reliability. With its advanced features and high-quality manufacturing, this product is ideal for a wide range of applications. From differential mux input conditioning to 3-state output characteristics, this chip carrier offers unparalleled performance. Elevate your projects with the value and benefits of the LMK04816BISQ/NOPB, delivering superior results with every use.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power sources and integrated circuits.

Load Capacitance (CL): 5 pF

Low load capacitance helps in reducing signal distortion and improving signal integrity in high-speed applications.

Maximum I (ol): 0.5 Amp

High output current capability of 0.5 Amp allows driving of multiple loads without overheating or performance degradation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85°C makes this product suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable performance in extreme cold conditions.

No. of True Outputs: 12

Having 12 true outputs provides flexibility and versatility in signal routing and distribution applications.

Minimum fmax: 2600 MHz

With a high maximum frequency of 2600 MHz, this clock driver can support high-speed data transmission and processing needs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the product is suitable for surface mount assembly without requiring special handling or storage conditions.

Technical Specifications

Clock Drivers & Buffers LMK04816BISQ/NOPB attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

4000/14000/40000

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Maximum I (ol):

.5 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Minimum fmax:

2600 MHz

Trade Compliance

LMK04816BISQ/NOPB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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