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LMH6560MA

Texas Instruments

LMH6560MA by Texas Instruments

LMH6560MA by Texas Instruments is a buffer amplifier with 4 functions, -14uA max average bias current, and 25mV max input offset voltage. It operates in industrial temperature range and is ideal for applications requiring high-speed signal buffering in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,480 parts In-Stock

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7,480

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Digiode

USA . 2,118 parts In-Stock

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2,118

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Anansix

USA . 1,796 parts In-Stock

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1,796

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Distributors (Availability)

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One Stop Electronics

USA . 414 parts In-Stock

1+ parts

$3.410

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-

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414

$3.410

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Parana Technologies

USA . 1,215 parts In-Stock

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$6.127

100+ parts

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$6.897

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1,215

$6.127

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$6.897

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DigiPath Technology Company

USA . 182 parts In-Stock

1+ parts

$6.746

100+ parts

$6.207

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182

$6.746

$6.207

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ChromeModa Solutions

Germany . 4,210 parts In-Stock

1+ parts

$6.884

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$5.645

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4,210

$6.884

$5.645

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IDEA Electronic Components Group

UK . 2,334 parts In-Stock

1+ parts

$6.884

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$6.196

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2,334

$6.884

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$6.196

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AZTECH Wire

Italy . 331 parts In-Stock

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$7.375

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331

$7.375

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 1,593 parts In-Stock

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1,593

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Overview

Elevate your electronic designs with the LMH6560MA by Texas Instruments, a high-quality buffer amplifier that offers exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this versatile component is ideal for a wide range of applications in the electronics industry. Whether you're working on audio equipment, communication systems, or industrial machinery, this compact and efficient buffer amplifier delivers unmatched value and benefits to customers. Upgrade your projects today with the LMH6560MA and experience superior quality and performance like never before. Elevate your designs with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for long-term use.

Maximum Input Offset Voltage: 25000 uV

High input offset voltage ensures accurate signal processing and reduces errors in the output data.

Surface Mount: YES

Surface mount capability allows for easy installation and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage ensures consistent performance of the buffer amplifier.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this buffer amplifier can withstand harsh environmental conditions.

Technical Specifications

Buffer Amplifiers LMH6560MA attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

4

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Slew Rate:

3100 V/us

Input Offset Voltage Limit:

25 mV

Peak Bias Current:

-14 μA

Maximum Bias Current (IIB) @25 °C:

-10 μA

Operational Characteristics

Maximum Supply Current:

63 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.5 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-6.5 V

Lowest Output Current:

40 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.34 in (8.6235 mm)

Width:

0.154 in (3.899 mm)

Maximum Seated Height:

0.069 in (1.753 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Rail

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

LMH6560MA Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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