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XBUF634AIDRBT

Texas Instruments

XBUF634AIDRBT by Texas Instruments

XBUF634AIDRBT by Texas Instruments is a Buffer Amplifier with 60000uV Max Input Offset Voltage, 2uA Max Average Bias Current, and 210MHz Nominal Bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,411 parts In-Stock

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4,411

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Digiode

USA . 2,963 parts In-Stock

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2,963

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Cyclops Electronics Ltd

UK . 1,250 parts In-Stock

1+ parts

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1,250

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,395 parts In-Stock

1+ parts

$2.410

100+ parts

$2.350

1k+ parts

$2.338

10k+ parts

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1,395

$2.410

$2.350

$2.338

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Parana Technologies

USA . 1,294 parts In-Stock

1+ parts

$4.784

100+ parts

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$5.289

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1,294

$4.784

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$5.289

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DigiPath Technology Company

USA . 1,875 parts In-Stock

1+ parts

$5.268

100+ parts

$4.846

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1,875

$5.268

$4.846

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IDEA Electronic Components Group

UK . 1,049 parts In-Stock

1+ parts

$5.375

100+ parts

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$4.838

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1,049

$5.375

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$4.838

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ChromeModa Solutions

Germany . 48 parts In-Stock

1+ parts

$5.375

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$4.408

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48

$5.375

$4.408

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One Stop Electronics

USA . 1,553 parts In-Stock

1+ parts

$7.410

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1,553

$7.410

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Ampacity Inc.

Singapore . 290 parts In-Stock

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$7.410

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290

$7.410

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AZTECH Wire

Italy . 339 parts In-Stock

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$14.742

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339

$14.742

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Continental Prestige Electronics

USA . 6,505 parts In-Stock

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Argo Parts USA

USA . 1,574 parts In-Stock

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Corphita

USA . 1,353 parts In-Stock

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1,353

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Enhance your electronic designs with the Texas Instruments XBUF634AIDRBT buffer amplifier. Manufactured by a trusted industry leader, this high-quality product offers reliable performance and precision. Ideal for a wide range of applications, this buffer amplifier provides customers with exceptional value, improved signal integrity, and enhanced circuit stability. Elevate your projects with the superior benefits and advantages of the XBUF634AIDRBT from Texas Instruments.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and reliability for long-term use.

Maximum Input Offset Voltage

60000 uV - Ensures accurate and precise signal processing.

Maximum Average Bias Current (IIB)

2 uA - Low bias current helps maintain signal integrity.

Surface Mount

YES - Easy to install and suitable for compact designs.

Package Shape

SQUARE - Allows for efficient use of space on circuit boards.

Nominal Supply Voltage / Vsup (V)

15 - Provides stable power for optimal performance.

No. of Terminals

8 - Allows for multiple connections and flexibility in circuit design.

Package Style (Meter)

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - Offers thermal management and space-saving features.

Maximum Supply Voltage Limit

20 V - Ensures safe operation within specified voltage range.

Maximum Operating Temperature

125 °C - Suitable for use in automotive or industrial environments.

Maximum Bias Current (IIB) @25°C

2 uA - Maintains signal quality under varying temperatures.

Minimum Operating Temperature

40 °C - Can withstand extreme temperatures for versatile application.

Terminal Position

DUAL - Allows for easy connection and installation.

Maximum Seated Height

1 mm - Low profile design for compact setups.

Width

3 mm - Compact size for space-constrained applications.

Nominal Bandwidth (3dB)

210 MHz - High bandwidth for fast signal processing.

Length

3 mm - Compact size for space-saving installation.

Temperature Grade

AUTOMOTIVE - Suitable for automotive applications with varying temperature conditions.

Maximum Negative Supply Voltage Limit

20 V - Can operate within a wide voltage range.

Terminal Form

NO LEAD - Simplifies installation and connection process.

Amplifier Type

BUFFER - Ideal for buffering and amplifying signals.

Maximum Supply Current

12 mA - Can handle high current loads for consistent performance.

Nominal Negative Supply Voltage (Vsup)

15 V - Provides dual power options for versatile operation.

Packing Method

TR - Convenient packaging for storage and transportation.

Nominal Slow Rate

3750 V/us - Fast response rate for efficient signal processing.

Terminal Pitch

0.65 mm - Suitable for precise connection and integration.

Technical Specifications

Buffer Amplifiers XBUF634AIDRBT attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

210 MHz

Nominal Slew Rate:

3750 V/us

Input Offset Voltage Limit:

60 mV

Peak Bias Current:

2 uA

Maximum Bias Current (IIB) @25 °C:

2 uA

Operational Characteristics

Maximum Supply Current:

12 mA

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

20 V

Nominal Negative Supply Voltage (Vsup):

-15 V

Maximum Negative Supply Voltage:

-20 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

S-PDSO-N8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Equivalence Code:

SOLCC8,.11,25

Trade Compliance

XBUF634AIDRBT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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